Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of surface coating preparation method of chip

A surface coating and chip technology, applied in the post-processing of printing, printing, printing devices, etc., can solve the problems of overflowing ink, spending more than 3 hours, and large consumption of paint, achieving accurate appearance and size, not easy to overflow ink, The effect of reducing production costs

Active Publication Date: 2018-04-03
JIANGSU A KERR BIOLOGICAL RECOGNITION TECH CO LTD
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And it takes more than 3 hours for equipment debugging; in the production process, the consumption of paint is large, the minimum amount of paint is more than 15kg, and the fingerprint biometric chip products that can be produced per hour are between 10000-20000PCS, and if using If the paint reaches more than 50kg, the environment will also be greatly affected
[0004] In addition, the appearance size of the fingerprint biometric chip produced by the spraying process is 0.05mm-0.1mm larger than the original chip size, and there is obvious ink overflow phenomenon

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of surface coating preparation method of chip
  • A kind of surface coating preparation method of chip
  • A kind of surface coating preparation method of chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Figure 1a Embodiment 1 of the present invention provides a method for preparing the surface coating of a chip, such as Figure 1a As shown, the method includes:

[0035] S1: Prepare a preset number of openings on the screen printing screen through photosensitive glue, wherein the size of the openings is the same as the size of the chip.

[0036] In this embodiment, the mesh of the screen printing screen is between 350 mesh and 420 mesh, and the screen on the screen printing screen is woven with silk formed of polyester material or metal material. In the process of forming the opening, it is necessary to apply photosensitive glue on the screen printing screen, and then dry it. The screen printing screen coated with photosensitive glue is exposed through the mask plate, developed and dried. Among them, the photosensitive glue that has been irradiated by light is removed, and the photosensitive glue that has not been irradiated by light still exists, such as Figure 1b ...

Embodiment 2

[0048] figure 2 A flow chart of the preparation method of the surface coating of a chip is provided in this embodiment, as figure 2 As shown, some steps are added on the basis of the above-mentioned embodiment one, such as figure 2 As shown, the methods described include:

[0049] S1: Prepare a preset number of openings on the screen printing screen through photosensitive glue, wherein the size of the openings is the same as the size of the chip.

[0050] S2: Place a preset number of chips in the grooves on the printing fixture, and make the chips correspond to the openings on the screen printing screen.

[0051] S3: Pour the first ink into one end of the screen printing screen, and use the scraper to scrape the screen printing screen, so that the first ink on the screen printing screen enters the opening formed by the photosensitive adhesive to print the first ink on the surface of the chip.

[0052] S4: Baking the chip with the first ink printed on its surface in an o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparing method of surface coatings of chips. The method comprises the steps that 1, the preset number of openings are prepared in a silk-print screen through photo-sensitive resist, wherein the size of the openings is the same as that of the chips; 2, the preset number of chips are placed in a groove in a printing jig, and the chips are made to correspond to the openings in the silk-print screen; 3, first ink is poured into one end of the silk-print screen, and a scraping plate is utilized for carrying out scraping on the silk-print screen to enable the first ink located on the silk-print screen to enter the openings formed by the photo-sensitive resist, so that the first ink is printed on the surfaces of the chips; 4, the chips with the surfaces printed with the first ink are baked in an oven for first preset time at the first preset temperature and then cooled. By means of the preparing method, the production cost is reduced, the appearance size of the chips is more accurate, and ink overflowing can not be caused easily.

Description

technical field [0001] The invention relates to the technical field of chip surface treatment, in particular to a method for preparing a chip surface coating. Background technique [0002] At present, the surface coating of the fingerprint biometric chip is realized by spraying. When the chip is sprayed by the spraying process, the production cost input is relatively large. [0003] For example, if an automatic spraying production line wants to achieve more than 3 coatings and 3 baking processes, it needs to invest 5 million to 15 million in assets. And it takes more than 3 hours for equipment debugging; in the production process, the consumption of paint is large, the minimum amount of paint is more than 15kg, and the fingerprint biometric chip products that can be produced per hour are between 10000-20000PCS, and if using If the paint reaches more than 50kg, the environment will also be greatly affected. [0004] In addition, the appearance size of the fingerprint biome...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B41M1/12B41M7/00
CPCB41M1/12B41M7/00B41M7/0081B41M7/009
Inventor 钱九二黄启建王凯
Owner JIANGSU A KERR BIOLOGICAL RECOGNITION TECH CO LTD