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Method for maintaining continuous internal wiring impedance of ball grid array (BGA) package

A technology of continuous impedance and internal wiring, applied in the field of electronic information, can solve problems such as signal attenuation, signal loss, and impedance inconsistency, and achieve the effect of reducing impedance, reducing attenuation, and maintaining impedance consistency

Active Publication Date: 2016-07-27
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, where the impedance is discontinuous, reflection or scattering will occur, resulting in signal loss
In the BGA package, some signals go out directly from the surface layer, and some need to lay a small short line before drilling to other layers for wiring. Since there is a difference between the fixed size of the BGA pad and the width of the transmission line with a certain impedance, the two The impedance of a place is inconsistent, which will cause reflection and cause signal attenuation.

Method used

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  • Method for maintaining continuous internal wiring impedance of ball grid array (BGA) package
  • Method for maintaining continuous internal wiring impedance of ball grid array (BGA) package
  • Method for maintaining continuous internal wiring impedance of ball grid array (BGA) package

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Embodiment Construction

[0026] The core idea of ​​the present invention is to provide a method for keeping the internal wiring impedance of the BGA package continuous, which can maintain the impedance consistency of the internal signal of the BGA package and reduce the attenuation of the signal due to discontinuous impedance.

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] The first method for keeping the internal wiring impedance of the BGA package continuous, provided by the embodiments of the p...

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Abstract

The invention discloses a method for maintaining continuous internal wiring impedance of ball grid array (BGA) package. The method comprises the following steps of excavating a position, arranged below a bonding pad, in an adjacent layer of the bonding pad which is arranged in the same layer, where a transmission line is arranged, of the BGA; and setting a fourth layer under the bonding pad as a reference layer of the bonding pad, wherein the area of the excavated position is at least greater than the area of the bonding pad. With the method for maintaining continuous internal wiring impedance of the BGA package, provided by the invention, the impedance consistency of BAG package internal signals can be maintained, and the attenuation of the signals brought by discontinuous impedance is reduced.

Description

technical field [0001] The invention belongs to the technical field of electronic information, and particularly relates to a method for maintaining the continuity of wiring impedance inside a BGA package. Background technique [0002] The full name of BGA is BallGridArray (PCB with ball grid array structure), which is a packaging method in which integrated circuits use organic carrier boards. Self-centered, easy to tin, high reliability, good electrical performance and low overall cost. [0003] As signal rates get higher and higher, every factor that can affect signal integrity is addressed in detail. As we all know, where the impedance is discontinuous, reflection or scattering will occur, resulting in signal loss. In the BGA package, some signals are directly routed from the surface layer, and some need to be routed through a small short line and then drilled to other layers for wiring. Due to the difference between the fixed size of the BGA pad and the width of the tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L24/43H01L2021/60007
Inventor 宗艳艳贡维
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND