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A method to keep the internal wiring impedance of bga package continuous

A technology with continuous impedance and internal wiring, applied in the field of electronic information, it can solve the problems of inconsistent impedance, signal attenuation, signal loss, etc., and achieve the effect of maintaining impedance consistency, reducing attenuation, and reducing impedance.

Active Publication Date: 2018-10-30
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, where the impedance is discontinuous, reflection or scattering will occur, resulting in signal loss
In the BGA package, some signals go out directly from the surface layer, and some need to lay a small short line before drilling to other layers for wiring. Since there is a difference between the fixed size of the BGA pad and the width of the transmission line with a certain impedance, the two The impedance of a place is inconsistent, which will cause reflection and cause signal attenuation.

Method used

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  • A method to keep the internal wiring impedance of bga package continuous
  • A method to keep the internal wiring impedance of bga package continuous
  • A method to keep the internal wiring impedance of bga package continuous

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Embodiment Construction

[0026] The core idea of ​​the present invention is to provide a method for maintaining the continuity of the internal wiring impedance of the BGA package, which can maintain the impedance consistency of the internal signal of the BGA package and reduce the attenuation of the signal caused by the impedance discontinuity.

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] The first method for maintaining the continuity of the internal wiring impedance of the BGA package provided by the embodiment of the ...

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Abstract

This application discloses a method of keeping the internal wiring impedance of the BGA packaging, including: the neighboring layer of the pads of the BGA in the same layer fabrics is located in the position below the pad.The four layers are the reference layer of the pad, where the area of the hollowing position is at least greater than the area of the pad.The above -mentioned method provided by this application to keep the internal wiring impedance of the BGA packaging can maintain the impedance consistency of the internal signal of the BGA packaging and reduce the attenuation caused by the increasing impedance.

Description

technical field [0001] The invention belongs to the technical field of electronic information, in particular to a method for keeping the internal wiring impedance of a BGA package continuous. Background technique [0002] The full name of BGA is Ball Grid Array (PCB with ball grid array structure). It is a packaging method in which integrated circuits use organic carrier boards. It has the characteristics of self-centering and easy tinning, high reliability, good electrical performance and low overall cost. [0003] As signaling rates increase, the details of every factor that can affect signal integrity are addressed. As we all know, where the impedance is discontinuous, reflection or scattering will occur, resulting in signal loss. In the BGA package, some signals go out directly from the surface layer, and some need to lay a small short line before drilling to other layers for wiring. Since there is a difference between the fixed size of the BGA pad and the width of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/43H01L2021/60007
Inventor 宗艳艳贡维
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND