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Chip on board (COB) optical module with high level protection and fabrication method thereof

An optical module, a high-level technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of lack of design sense, degradation of housing protection performance, limitation of three-dimensional design and design creativity of lamp housing, etc., to achieve good insulation, The effect of long life and excellent thermal conductivity

Active Publication Date: 2016-07-27
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a protection method limits the three-dimensional design and design creativity of the lamp housing
Makes the shell of outdoor lamps dull and has no sense of design
At the same time, because the joint is coated with sealant, it is inconvenient to repair and replace the internal light source or power supply or the replacement is easy, which reduces the protective performance of the shell

Method used

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  • Chip on board (COB) optical module with high level protection and fabrication method thereof
  • Chip on board (COB) optical module with high level protection and fabrication method thereof

Examples

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Embodiment Construction

[0031] Below, in conjunction with accompanying drawing and specific embodiment, the present invention is described further:

[0032] Such as figure 1 As shown, a high-level protective COB optical module includes a circuit substrate 3, a light-emitting device 2, a transparent casing 1, a filling glue 6, a high-reflection film 8, a power supply device 4, and a waterproof wiring socket 5. The light-emitting device 2. The power supply device 4 and the waterproof wiring base 5 are installed on the circuit substrate 3, the light emitting device 2 is electrically connected to the waterproof wiring base 5 through the power supply device 4, the light emitting device 2 is a light emitting diode, and the light emitting diode Encased in silicone mixed with fluorescent powder. The light emitting diode and the power supply device 4 are physically independent from each other, and there is a certain distance between them.

[0033] The transparent casing 1 is compression-molded on the circui...

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Abstract

The invention provides a chip on board (COB) optical module with high level protection. The COB optical module comprises a circuit substrate, a luminous device, a transparent shell, a filling adhesive, a power supply device and a waterproof wiring female seat, wherein the luminous device, the power supply device and the waterproof wiring female seat are arranged on the circuit substrate, the luminous device is electrically connected with the waterproof wiring female seat through the power supply device, the transparent shell is compacted on the circuit board by a compression molding formation process, an adhesive injection hole is formed in the transparent shell, an external hollow cavity is filled with the filling adhesive, and the waterproof wiring female seat is arranged at the edge of the transparent shell. On the condition of sealing, no air circulation is generated, heat is generated when a power supply works, and the service lifetime of the power supply can be affected if the heat cannot be timely conducted out and the power supply works for a long time; and the filling adhesive has favorable heat conduction effect, the heat of the power supply can be timely conducted out, so that the service lifetime of the COB optical module is longer.

Description

technical field [0001] The invention belongs to the field of light-emitting diode structure packaging, and in particular relates to a high-level protective COB optical module and a preparation method. Background technique [0002] Since the packaging structure of the light emitting diode is an open structure, it does not have sealing performance, and at the same time, it is easily affected by water, dust or polluting gas in the outdoor environment, thereby reducing the service life of the light emitting diode. Generally, for outdoor lighting fixtures, sealant pads or sealant are added to the joints of the shells to protect the internal LED modules. Such a protection method limits the three-dimensional design and design creativity of the lamp housing. It makes the shell of the outdoor lamp dull and has no sense of design. At the same time, because the joint is coated with sealant, it is inconvenient to maintain and replace the internal light source or power supply or the re...

Claims

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Application Information

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IPC IPC(8): H01L33/56H01L33/64
CPCH01L33/56H01L33/641
Inventor 肖浩刘俊达李明珠苏佳槟孙婷
Owner GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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