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Light emitting device packaging

A technology for light-emitting devices and packaging bodies, applied in the field of manufacturing packaged devices

Active Publication Date: 2019-11-01
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the package has a relatively simple structure
Although this can make package fabrication more straightforward, package assembly requires an additional wire bonding step

Method used

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  • Light emitting device packaging
  • Light emitting device packaging
  • Light emitting device packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] The present invention provides a method of packaging a light emitting device and a packaged light emitting device.

[0054] refer to figure 1 , showing a general view of the package. figure 2 shows the packaged light-emitting device, namely figure 1 Light emitting device die in a package. In this example, the light emitting devices are LEDs, but similar packaging schemes can be used for other solid state light emitting devices.

[0055] refer to figure 1 , the contoured lead frame 10 is made of Cu and has been etched to have a specific profile or shape, for example the lead frame 10 has varying thicknesses, such as figure 1 As shown in , and / or the lead frame 10 has a shape with dimensions that vary in at least two directions. The thickness is defined in this case as the distance between the upper surface of the lead frame 10 on which bonding is to be performed and the surface opposite to the bonding surface. as in figure 1 As can be seen in , the leadframe 10 h...

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PUM

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Abstract

A packaged light emitting device die (20) includes a package body having a contoured lead frame (10) embedded in a body of reflective material (12). The lead frame (10) is exposed on the mounting surface (14) only on at least one solder bond area (16). Solder (22) is only present on at least one solder bond area (16) and nowhere else. The reflective material provides the reflective part of the package, so there is no need for a reflective layer deposited on the leadframe (10). Also, the reflective material may act as a solder stop to self-align the solder (22) to the at least one solder bond area (16).

Description

technical field [0001] The present invention relates to packaged light emitting devices, packages for light emitting devices and methods of manufacturing packaged devices. Background technique [0002] Many different approaches to generating light from solid state light emitting devices are known. [0003] A very common solution is to use light emitting diodes (LEDs), which are increasingly used in many applications due to their efficiency in generating light. In order to use such LEDs, the LED dies are packaged to protect the dies while allowing light to be emitted and to allow electrical connections to the LED dies. Since LEDs may generate considerable amounts of heat, such packages may also need to allow for the removal of heat, and thus act as heat sinks. [0004] LED technology does not represent the only way to generate light in solid state devices. In particular, an alternative involves the use of laser diodes. A large number of types of laser diodes are known, in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/60H01L33/62
CPCH01L33/60H01L33/62H01L2224/16245H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/00014H01L2224/32245H01L2924/00H01L2924/00012H01L33/005H01L2924/12041
Inventor P.迪克斯特拉A.赖因茨博克P.J.T.L.奥伯恩多尔夫张路飞B.R.德容M.F.唐克
Owner LUMILEDS HLDG BV