Display device and manufacturing method thereof

Abstract

An embodiment of the present invention provides a display device and a manufacturing method thereof, wherein the manufacturing method includes: attaching an electrostatic shielding layer on the edge area of ​​the connecting line pattern, and the connecting line pattern is exposed on the display panel; wherein the electrostatic shielding The layer has an area of ​​insulating material, the area of ​​insulating material contacts the area where the connection line pattern is located, and the area in the edge area other than the area where the connection line pattern is located contacts the conductive material on the surface of the electrostatic shielding layer. area. The display device provided by the embodiment of the present invention is manufactured by the above manufacturing method. The embodiment of the present invention can improve the anti-ESD capability of the edge chip connection line without increasing the process flow. In addition, the electrostatic shielding layer formed of materials including metal is non-transparent. Compared with photosensitive adhesives, it is easier to check the surface adhesion, and it is not easy to produce surface flatness defects, which is conducive to the improvement of product yield and performance.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display device and a manufacturing method thereof. Background technique [0002] For FIC (Film Integrated Circuit, film integrated circuit) products, electrostatic discharge (Electro-Static discharge, ESD) is likely to cause damage and damage to the products. For a display device, a driver IC is an important circuit component. In practical applications, due to the requirements of the manufacturing process, a layer of photosensitive glue (photosensitive glue) will be coated on the metal terminal area of ​​the driver chip. Photosensitive adhesive can prevent metal terminals from short-circuiting in contact with conductors, but photosensitive adhesive is transparent, it is not easy to check its surface smoothness and has little effect on anti-ESD. [0003] However, at present, the anti-ESD capability of the driver chip has become one of the important reference factors for the a...

AI Technical Summary

Problems solved by technology

For example, the anti-ESD specification of driver chips currently on the market is about 2kV, but due to the constraints of existing technologies, it cannot meet the minimum certification standards for mobile terminals (generally 6-8kV), which leads to the overall performance of this type of display products decline

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