A sim card holder marking machine

Abstract

The invention discloses a marking machine of an SIM (Subscriber Identity Module) card seat. A first base plate is fixedly connected onto a left side edge of a first supporting plate through a screw; the bottom end of a first bracket is fixed at the left side edge of the first base plate; the upper end of the first bracket is connected with a raw material belt pulley; a supporting framework is arranged on a middle end face of the first supporting plate; a feeding mechanism is arranged on the upper end face of the supporting framework; a supporting platform is arranged at the middle position of a rear side part of a first supporting framework; the supporting platform is connected with a laser machine; a first driving motor and a second driving motor are arranged at the positions of back central shafts of the raw material belt pulley and a material receiving belt pulley respectively; a second supporting plate is connected with a control device through a third bracket. The marking machine of the SIM card seat has the beneficial effects that the supporting platform is provided with the laser machine for marking, the driving motors are arranged at the positions of the central shafts of the raw material belt pulley and the material receiving belt pulley, and the driving motors are used for driving; the marking machine is simple in structure, remarkable in marking effect and simple and convenient to operate, and has very high practicability.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a marking machine for a SIM card holder. Background technique [0002] Laser marking machines are widely used in the surface marking of integrated circuits in the SIM card industry. According to different usage requirements, the integrated circuit boards used in the SIM card industry have three forms: strips, chips and wafers; among them, strips are sheets composed of several chips. When marking each chip , automatic marking is realized directly by conveying the material strip; the chip is a small block of granular material, when marking, it is placed in the track tray, and automatic marking is realized by conveying the track tray; the wafer is directly on it A thin wafer with multiple (grain) chips is produced. When marking, it is necessary to mark the back of each (grain) chip on the entire wafer sheet. [0003] At present, there are two kinds of marking equipment used for...

AI Technical Summary

Problems solved by technology

However, the loading and unloading devices of these marking equipment are distributed at the initial ends of the line-arranged strip conveying device, and it is necessary to use independent loading and unloading devices and unloading devices for loading and unloading respectively. Material and unloading, and the structure of the pick-and-place device for loading and unloading is also different, which makes the structure more complicated, and then has the defects of cumbersome operation, inconvenient maintenance and high cost

Images