Sensing chip, fingerprint recognition module, manufacturing method of fingerprint recognition module and mobile terminal

Abstract

The invention discloses a sensing chip, a fingerprint recognition module, a manufacturing method of the fingerprint recognition module and a mobile terminal. The sensing chip is suitable for being attached to a flexible printed circuit board and comprises an attaching part and a spraying part, wherein the lower surface of the attaching part is suitable for being attached to the flexible printed circuit board, the spraying part is connected with the attaching part and located on the attaching part, and the periphery of the spraying part exceeds the periphery of the attaching part. According to the sensing chip of the fingerprint recognition module, the sensing chip is set to comprise the attaching part and the spraying part, the attaching part is attached to the flexible printed circuit board so that the sensing chip can be electrically connected with the flexible printed circuit board, the spraying part is sprayed so that the attractiveness of the appearance of the fingerprint recognition module can be improved. Meanwhile, the periphery of the spraying part exceeds the periphery of the attaching part so that the sensing chip can be protected against damage in the machining process of the sensing chip, and the working reliability of the sensing chip is improved.

Description

Technical field [0001] The present invention relates to the technical field of electronic equipment, in particular to a sensor chip, a fingerprint identification module, a manufacturing method thereof, and a mobile terminal. Background technique [0002] The application of fingerprint recognition modules in various electronic products is becoming more and more extensive. In order to achieve an aesthetic effect, appearance processing will be done on the surface of the fingerprint recognition module. In related technologies, surface treatment includes spraying and surface attachment of decorative sheets (such as glass, sapphire, ceramic sheets, etc.). But spraying can only be matte spraying, because after the high-gloss spraying is over the high temperature of reflow soldering, the surface ink will be colored, the adhesion will be poor, and the appearance of orange peel will be poor. Surface-attached decorative sheets can also achieve high-gloss effects, but compared with the hig...

AI Technical Summary

Problems solved by technology

However, spraying can only be done with matte spraying, because the high-gloss spraying will cause color cast on the surface of the chip after the high temperature of the reflow soldering, the adhesion will become poor, and the appearance of orange peel will be poor.

The surface-attached decorative sheet can also achieve a high-gloss effect, but compared with the high-gloss spraying process, the defect rate is higher, and the additional decorative sheet also brings an increase in cost, and the surface-attached material increases the distance from the finger to the sensor chip. distance, resulting in a decrease in the sensing effect

Images