Integrated encapsulating and potting device for sensor and operation method thereof

Abstract

The invention discloses an integrated encapsulating and potting device for a sensor. The integrated encapsulating and potting device is characterized in that a plurality of first grooves are formed in an edge structure on each of the two sides of a bearing frame; an encapsulating plate is placed in the first grooves, and a plurality of second grooves are formed in one side of the encapsulating plate; a shell placing plate is arranged in the middle of the bearing frame and is fixed by a screw, at least 20 holes are formed in the shell placing plate, and a shell is placed in each of the holes; each shell corresponds to a component placed in the corresponding second groove in the encapsulating plate. The operation method comprises the following steps: 1, placing the components in the second grooves in the encapsulating plate and encapsulating; 2, fixing the shell placing plate through the screw on the bearing frame; 3, adjusting a sleeve and the screw and adjusting the position of the shell placing plate; 4, placing the shell on the shell placing plate and placing the whole encapsulating plate on the bearing frame; 5, encapsulating and solidifying the bearing frame. The integrated encapsulating and potting device disclosed by the invention is simple, convenient and quick to operate, low in material and manpower consumption, and can improve the efficiency, save the space and facilitate subsequent process flow.

Description

technical field [0001] The invention relates to the field of sensor production, in particular to a device for integrating encapsulation and potting in the production process of a temperature sensor and an operation method thereof. Background technique [0002] After the thermistor or chip is welded with the wire, it needs to be insulated and withstand voltage protection, that is, encapsulated, and then encapsulated, that is, potted in the shell to make a temperature sensor. Before encapsulating, the products to be encapsulated must be arranged in an orderly manner. On the encapsulating wooden frame, wrap the thermistor, lead wires and the exposed parts of the welding with glue. After it is completely cured, remove all the encapsulated products from the wooden frame, and then wrap the encapsulated product one by one. One by one is put into the casing and then potted. During the potting process, the wires still need to be fixed on the potting wooden frame, and then all of them...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, during the entire production process of encapsulation and potting, the wiring harness needs to be tied and dismantled twice, the production process is cumbersome and wastes labor and material costs, and at the same time, the encapsulated products need to be put into the casing one by one , the efficiency is relatively low, and the number of shells placed on the potting wooden frame is limited. During the production process, a large number of wooden frames are required to occupy space and are not conducive to the circulation of subsequent processes.

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