Package structure and package method of blue-light LED flip chip

Abstract

The invention discloses a package structure and package method of a blue-light LED flip chip. The package structure comprises a substrate, a chip, a fluorescent powder adhesive layer and white reflection adhesive layers, wherein the chip is inversely arranged on the substrate, the fluorescent powder adhesive layer covers the top surface of the chip, and the reflection adhesive layers encircle the periphery of the chip. The package method comprises the following steps of 1) fixedly welding a plurality of chips on the substrate, wherein the chips are arranged in a matrix way; 2) coating gaps among the chips with the white reflection adhesive layers, wherein the heights of reflection adhesives are flush with the heights of the chips; 3) covering the top surfaces of the chips and the top surfaces of the reflection adhesives with the fluorescent powder adhesive layer; and 4) cutting an LED lamp panel to a plurality of LED lamps after the fluorescent powder adhesive layer is cured. The white reflection adhesives encircle the periphery of the blue-light LED flip chip, only the top surface of the whole chip is reserved, the top surface of the chip is coated with the fluorescent powder adhesive layer, fluorescent powder in the adhesive layer is uniform in distribution, uniform given-out light of the LED lamps is ensured, and a light spot is eliminated.

Description

[technical field] [0001] The invention relates to LED chip packaging, in particular to a packaging structure and packaging method for a blue LED flip chip. [Background technique] [0002] Usually all six sides of LED flip chip can emit light. After the bottom of the LED flip chip is soldered on the substrate by eutectic or reflow soldering, the other five sides emit light. Since conventional chips emit blue light, phosphor powder should be coated around the chip during packaging. [0003] The invention with the application number CN201410561610.9 discloses a high-reliability LED packaging structure, including a metal bracket and at least one LED flip chip. The LED flip chip is fixed on the metal bracket by flip-chip technology, and the LED flip chip The surface is coated with fluorescent powder, and the LED flip-chip and metal bracket are covered together with epoxy resin. [0004] Since the phosphor is a colloidal liquid mixed with powder and glue, the powder is still sl...

AI Technical Summary

Problems solved by technology

When this packaging structure is used for highly concentrated lighting such as a flashlight, the light spots are very obvious, which affects the lighting effect

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