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Chemical vapor deposition device, and chemical vapor deposition method

A technology of chemical vapor deposition and rotary drive device, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of unevenness, reduced film uniformity of cutting tools, and poor gas supply, etc. The effect of suppressing clogging

Active Publication Date: 2016-08-24
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using gas species with high reactivity with each other, the raw material gas becomes easy to react in the supply path
As a result, the reaction product generated by the reaction of the raw material gas is deposited inside the gas supply pipe and the gas discharge port, and a problem of poor gas supply may occur.
As a result, unevenness occurs in the reaction state of the gas, and the uniformity of the film quality of each cutting tool in the reaction vessel may decrease.

Method used

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  • Chemical vapor deposition device, and chemical vapor deposition method
  • Chemical vapor deposition device, and chemical vapor deposition method
  • Chemical vapor deposition device, and chemical vapor deposition method

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no. 1 Embodiment approach

[0077] Hereinafter, as the first embodiment of the present invention, a chemical vapor deposition apparatus and a chemical vapor deposition method (hereinafter, referred to as the chemical vapor deposition apparatus of the present invention and the chemical vapor deposition method of the present invention, respectively), which are one aspect of the present invention, will be described. ), which will be described in detail below in conjunction with the accompanying drawings.

[0078] In addition, in each drawing, the same reference numerals are used for the same device components.

[0079] The invention of the present application can be applied to a decompression type chemical vapor deposition device and a chemical vapor deposition method, and the device and method are used to manufacture WC-based cemented carbide, TiCN-based cermet, Si 3 N 4 Base ceramic, Al 2 O 3 A surface-coated cutting tool or the like in which a base ceramic or cBN-based ultra-high pressure sintered bod...

no. 2 Embodiment approach

[0115] Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

[0116] (Chemical Vapor Deposition Device)

[0117] Figure 12 It is a cross-sectional view of the chemical vapor deposition apparatus according to the present embodiment. Figure 13It is a cross-sectional view showing a gas supply pipe and a rotary drive device. Figure 14 It is a cross-sectional view of the gas supply pipe.

[0118] The chemical vapor deposition apparatus 110 of the present embodiment is a CVD (Chemical Vapor Deposition) apparatus for forming a film on the surface of a film-forming object by reacting a plurality of source gases in a heating atmosphere. The chemical vapor deposition apparatus 110 of the present embodiment can be suitably used for the manufacture of a surface-coated cutting tool in which a hard layer is coated on the surface of a cutting tool base body made of cemented carbide or the like.

[0119] As the cutting tool substra...

no. 1 Embodiment

[0165] Next, the chemical vapor deposition apparatus and the chemical vapor deposition method of the present invention will be specifically described by way of examples with reference to the accompanying drawings.

[0166] In the embodiments of the present invention, the figure 1 The shown bell-shaped reaction vessel 6 and the decompression type chemical vapor deposition apparatus of the external heating type heater 7 (hereinafter, simply referred to as "the apparatus of this embodiment").

[0167] Here, the bell-shaped reaction vessel 6 has a diameter of 250 mm and a height of 750 mm, and the external heating heater 7 can heat the inside of the reaction vessel 6 to about 700 to 1050°C. In addition, the device of this embodiment has at least Figure 7 The bottom plate 1, the rotary gas introduction member 12, the raw material gas group A introduction port 27, the raw material gas group B introduction port 28, the raw material gas group A introduction passage 31, and the raw m...

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Abstract

A chemical vapor deposition device provided by the invention of the present application is equipped with: a reaction vessel in which an object on which a film is to be formed is placed; a gas supply pipe (5) which is arranged in the reaction vessel; and a rotary drive unit (2) which can rotate the gas supply pipe (5) by a rotation axis (22) in the reaction vessel. In the device, the inside of the gas supply pipe (5) is partitioned into a first gas circulation section (14) and a second gas circulation section (15) both extending along the rotation axis (22). On the pipe wall of the gas supply pipe (5), first gas injection ports (16), through which a first gas circulating in the first gas circulation section (14) can be injected into the reaction vessel, and second gas injection ports (17), through which a second gas circulating in the second gas circulation section (15) can be injected into the reaction vessel, are arranged, wherein each of the first gas injection ports (16) and each of the second gas injection ports (17) are arranged side-by-side in the direction of the periphery of the rotation axis (22). In a plane (23) of which the normal line is the rotation axis (22), each of the first gas injection port (16) and each of the multiple second gas injection port (17) become paired.

Description

technical field [0001] The present invention relates to a chemical vapor deposition device and a chemical vapor deposition method. [0002] The present application claims priority based on Patent Application No. 2014-003251 filed in Japan on January 10, 2014 and Patent Application No. 2014-259387 filed in Japan on December 22, 2014, the contents of which are incorporated herein by reference. Background technique [0003] Cutting tools with a hard coating on the surface have been used for a long time. For example, there are known surface-coated cutting tools in which a WC-based cemented carbide or the like is used as a substrate, and a hard layer such as TiC or TiN is coated on the surface by a chemical vapor deposition method. As an apparatus for coating the surface of a cutting tool base with a hard layer, for example, chemical vapor deposition apparatuses described in Patent Documents 1 to 3 are known. [0004] figure 1 A schematic side view of a conventionally known de...

Claims

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Application Information

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IPC IPC(8): C23C16/455
CPCC23C16/45574C23C16/45589C23C16/45514C23C16/45578C23C16/455
Inventor 龙冈翔山口健志
Owner MITSUBISHI MATERIALS CORP