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A cooling device, an upright system support, processing equipment and electronic equipment

A technology for electronic equipment and heat sinks, applied in the field of electronics, can solve the problems of single fixing of radiator structure and inability to adjust system equipment, etc., to achieve the effect of improving space accommodation and space applicability, improving overall electrical performance, and loose space layout

Active Publication Date: 2019-03-08
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides a cooling device, an upright system bracket, processing equipment and electronic equipment, which are used to solve the problems in the prior art that the radiator structure of upright columnar electronic equipment is relatively single and fixed, and it is impossible to make corresponding arrangements according to the configuration of the system equipment. technical issues with the adjustment

Method used

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  • A cooling device, an upright system support, processing equipment and electronic equipment
  • A cooling device, an upright system support, processing equipment and electronic equipment
  • A cooling device, an upright system support, processing equipment and electronic equipment

Examples

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Embodiment 1

[0056] Please refer to figure 1 , figure 2 , Embodiment 1 of the present application provides a heat dissipation device, including:

[0057] The first heat sink 101 is used to dissipate heat from the first heat generating device of the electronic equipment, and the first heat sink can be detachably arranged vertically on the vertical system support of the electronic equipment.

[0058] The second radiator 102 is used to dissipate heat from the second heat generating device of the electronic equipment, and the second radiator can be detachably arranged vertically on the stand of the vertical system; wherein, the vertical system The system motherboard of the electronic equipment is also arranged on the bracket.

[0059] The upright system support can be in various forms, for example, a cylindrical support with a circular bottom, a tetrahedral support with a triangular bottom, or a polygonal column support with a polygonal bottom, and so on. Of course, the upright system brac...

Embodiment 2

[0080] Please refer to image 3 , Embodiment 2 of the present application provides an upright system bracket, the upright system bracket is a cylindrical structure with a circular or polygonal base, and the system bracket includes:

[0081] The first radiator supporting sheet 201 is connected to the bottom edge on the first side of the upright system bracket, and is used to carry the first radiator;

[0082] The second heat sink supporting sheet 202 is connected to the bottom edge on the second side of the vertical system bracket, and is used for supporting the second heat sink.

[0083] Optionally, the first radiator supporting sheet 201 further includes a first placement hole 2011 for placing the first heater;

[0084] The second radiator supporting sheet also includes a second placing hole 2021 for placing the second heater.

[0085] Optionally, a first mounting hole is also provided on the first radiator support sheet, for installing the first heater on the first radiato...

Embodiment 3

[0091] Please refer to Figure 4, Embodiment 3 of the present application provides a processing device, including:

[0092] The upright system bracket;

[0093] a mainboard, arranged on the vertical system support;

[0094] The heat dissipation device is arranged on the vertical system support.

[0095] aforementioned figure 1 , image 3 Various variations and specific examples of the heat dissipation device and the vertical system support in the embodiment are also applicable to the processing equipment in this embodiment. Through the foregoing description of the heat dissipation device and the vertical system support, those skilled in the art can clearly The implementation method of the processing device in this embodiment is known, so for the sake of brevity of the description, it will not be described in detail here.

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Abstract

The invention discloses a radiating device, an upright type system bracket, processing equipment and electronic equipment. The radiating device comprises at least two radiators, which can be vertically arranged on the upright type system bracket in a detachable manner, thereby solving the technical problem that radiating components suitable for a radiator structure of the upright type cylindrical electronic equipment are fixed; and the radiating device can be used for radiating at least two heating devices selectively, thereby having the technical effect of improving applicability of the radiating device of the upright type cylindrical electronic equipment.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a cooling device, an upright system support, processing equipment and electronic equipment. Background technique [0002] At present, with the development of electronic information technology, the appearance structure of intelligent electronic equipment is developing towards more refinement and rationalization. In the vertical columnar computers on the market, the radiators are integrally designed, and the heat dissipation modules are also integrally designed and arranged in the center, and other computer device boards are locked on the heat dissipation modules. However, this design structure is relatively single and fixed, and cannot be adjusted according to the system configuration. When the user does not need to use unnecessary external devices such as graphics cards and sound cards, the heat dissipation module will still be equipped with these external devices. heat diss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/20H05K7/20418
Inventor 冯成
Owner LENOVO (BEIJING) LTD