A cooling device, an upright system support, processing equipment and electronic equipment
A technology for electronic equipment and heat sinks, applied in the field of electronics, can solve the problems of single fixing of radiator structure and inability to adjust system equipment, etc., to achieve the effect of improving space accommodation and space applicability, improving overall electrical performance, and loose space layout
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Embodiment 1
[0056] Please refer to figure 1 , figure 2 , Embodiment 1 of the present application provides a heat dissipation device, including:
[0057] The first heat sink 101 is used to dissipate heat from the first heat generating device of the electronic equipment, and the first heat sink can be detachably arranged vertically on the vertical system support of the electronic equipment.
[0058] The second radiator 102 is used to dissipate heat from the second heat generating device of the electronic equipment, and the second radiator can be detachably arranged vertically on the stand of the vertical system; wherein, the vertical system The system motherboard of the electronic equipment is also arranged on the bracket.
[0059] The upright system support can be in various forms, for example, a cylindrical support with a circular bottom, a tetrahedral support with a triangular bottom, or a polygonal column support with a polygonal bottom, and so on. Of course, the upright system brac...
Embodiment 2
[0080] Please refer to image 3 , Embodiment 2 of the present application provides an upright system bracket, the upright system bracket is a cylindrical structure with a circular or polygonal base, and the system bracket includes:
[0081] The first radiator supporting sheet 201 is connected to the bottom edge on the first side of the upright system bracket, and is used to carry the first radiator;
[0082] The second heat sink supporting sheet 202 is connected to the bottom edge on the second side of the vertical system bracket, and is used for supporting the second heat sink.
[0083] Optionally, the first radiator supporting sheet 201 further includes a first placement hole 2011 for placing the first heater;
[0084] The second radiator supporting sheet also includes a second placing hole 2021 for placing the second heater.
[0085] Optionally, a first mounting hole is also provided on the first radiator support sheet, for installing the first heater on the first radiato...
Embodiment 3
[0091] Please refer to Figure 4, Embodiment 3 of the present application provides a processing device, including:
[0092] The upright system bracket;
[0093] a mainboard, arranged on the vertical system support;
[0094] The heat dissipation device is arranged on the vertical system support.
[0095] aforementioned figure 1 , image 3 Various variations and specific examples of the heat dissipation device and the vertical system support in the embodiment are also applicable to the processing equipment in this embodiment. Through the foregoing description of the heat dissipation device and the vertical system support, those skilled in the art can clearly The implementation method of the processing device in this embodiment is known, so for the sake of brevity of the description, it will not be described in detail here.
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