Flip unit for double-sided bonding

A flipping device and double-sided technology, which is applied in the direction of assembling printed circuits, printed circuits, electrical components, etc. with electrical components, can solve the problems of difficult to achieve the required bonding accuracy and time-consuming

Active Publication Date: 2018-11-06
SHENZHEN LIANDE AUTOMATION EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional bonding machine (FOG) processing technology of flexible circuit board (FPC) and fiber optic board (FOP) is single-sided bonding. Nowadays, various products have higher and higher requirements for bonding of flexible circuit boards, such as Applied on TP and LCD, for the processing with high requirements, it is necessary to carry out double-sided bonding of the flexible circuit board. The traditional bonding machine needs to flip the flexible circuit board after bonding one side, and carry out the other side bonding. Bonding, very time-consuming and difficult to achieve the required bonding accuracy

Method used

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  • Flip unit for double-sided bonding
  • Flip unit for double-sided bonding
  • Flip unit for double-sided bonding

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Embodiment Construction

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be intervening elements at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0031] Unless otherwise defined, all technical and scientific terms used h...

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Abstract

The invention relates to a turnover device used for double-sided bonding. The turnover device comprises a support; a driving motor arranged on the support; a coupling shaft sleeving an output shaft of the driving motor; and an adsorption mechanism, which is detachably connected to the coupling shaft, and is used for adsorbing and fixing a flexible circuit board with a bound single side until the driving motor drives the adsorption mechanism to rotate 180 degrees, and then bonding the other side of the flexible circuit board. According to the above mentioned turnover device used for the double-sided bonding provided by the invention, after one side of the flexible circuit board is bound by a binding machine, the driving motor drives the adsorption mechanism to rotate, and the adsorption mechanism adsorbs and fixes the flexible circuit board and then rotates by 180 degrees, then the other side of the flexible circuit board can be bound; and besides, the overall structure is simple, the processing efficiency is high, the double-sided bonding precision is high, and the turnover device can be adapted to a high precision requirement of double-sided binding by the market.

Description

technical field [0001] The invention relates to the technical field of bonding, in particular to an overturning device for double-sided bonding. Background technique [0002] Bonding is a wire-bonding method in the chip production process. It is to connect the internal circuit of the chip to the package pin of the circuit board through gold wires, and then cover it with organic materials with special protection functions to complete the post-package. The chip is completely protected by organic Material protection, isolation from the outside world, is much higher than the traditional SMT placement method in terms of anti-corrosion, shock resistance and stability. The traditional bonding machine (FOG) processing technology of flexible circuit board (FPC) and fiber optic board (FOP) is single-sided bonding. Nowadays, various products have higher and higher requirements for bonding of flexible circuit boards, such as For TP and LCD applications, for high-demand processing, it i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/32
CPCH05K3/32H05K2203/049
Inventor 胡金曾强
Owner SHENZHEN LIANDE AUTOMATION EQUIP
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