Display panel and preparation method thereof and display device

A display panel and display area technology, which is applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., can solve problems such as easy breakage or peeling of circuit structure wiring, poor display of display panels, etc.

Active Publication Date: 2016-09-28
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for the display panels used in general common equipment, the base substrate is very thin, usually only about 10 μm in thickness, the circuit structure is fabricated on

Method used

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  • Display panel and preparation method thereof and display device
  • Display panel and preparation method thereof and display device
  • Display panel and preparation method thereof and display device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0050] The embodiment of the present invention provides a method for manufacturing a display panel, the display panel includes: figure 2 Shown in the display area A and non-display area B, such as figure 1 As shown, the preparation method of the display panel includes:

[0051] S101, such as figure 2 As shown, the non-display area B where the peripheral circuit 03 is formed is divided into a bending area C, and a protective layer 04 covering the peripheral circuit 03 is formed at least in the bending area C.

[0052] It should be noted that the display panel also includes a display area A. In this case, in order to realize the screen display function of the display panel, a display device layer 02 is also formed on the base substrate 01 of the display panel corresponding to the display area A. The display device layer 02 can be an OLED device layer (Organic Light Emitting Diode, organic light-emitting diode) or a liquid crystal display device layer, which can be selected according...

Example Embodiment

[0087] Example one

[0088] Before the non-display area B where the peripheral circuit 03 is formed is divided into the bending area C (step S101), the preparation method is as follows Figure 7 As shown, also includes:

[0089] S201, such as Figure 8a As shown, the first substrate 011 is disposed at least in the display area A.

[0090] S202: Disposing the second substrate 012 in the non-display area B.

[0091] S203. Splicing the first substrate 011 and the second substrate 012 to form the base substrate 01 of the display panel, and the second substrate 012 is made of a flexible material.

[0092] In this way, like Figure 8a As shown, the base substrate 01 is formed by splicing the first substrate 011 and the second substrate 012, and the second substrate 012 disposed in the non-display area B is made of flexible material, so as to achieve the purpose of at least bending the second substrate 012 .

[0093] The first substrate 011 is at least disposed in the display area A means that...

Example Embodiment

[0106] Example two

[0107] Before the non-display area B where the peripheral circuit 03 is formed is divided into the bending area C (step S101), as Picture 10 As shown, the preparation method also includes:

[0108] S301, such as Picture 11 As shown, the second substrate 012 is disposed in the non-display area B and the display area A;

[0109] S302. Attach the first substrate 011 to the upper surface of the second substrate 012 at a position corresponding to the display area A to form the base substrate 01 of the display panel, and the second substrate 012 is made of flexible material.

[0110] In this way, the base substrate 01 includes a second substrate 012 and a first substrate 011 disposed on the upper surface of the second substrate 012 corresponding to the display area A, wherein the first substrate 011 can be directly attached to the upper surface of the second substrate 012 It can also be fixedly arranged on the upper surface of the second substrate 012 in other ways, a...

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PUM

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Abstract

The embodiment of the invention provides a display panel and a preparation method thereof and a display device, and relates to the technical field of display devices. Fracture or stripping of lines manufactured on an underlying substrate when the non-display area of the underlying substrate is bent can be avoided. The preparation method of the display panel comprises the steps that a bending area is formed through division in the non-display area in which a peripheral circuit is formed, and a protective layer covering the peripheral circuit is formed in the bending area at least; and the display panel is bent to the lower surface of the display panel in the bending area. When the display panel is bent to the lower surface of the display panel through the bending area, the protective layer coated on the bending area can protect the peripheral circuit arranged on the surface of the bending area.

Description

technical field [0001] The invention relates to the technical field of display devices, in particular to a display panel, a manufacturing method thereof, and a display device. Background technique [0002] The size and weight of the display panel are important considerations when the display panel is used in the display device. In order to make the appearance of the electronic device more beautiful and the screen display area larger, it is required to narrow the frame size of the display panel as much as possible, that is, the so-called Narrow borders. At present, the existing technology has been able to achieve the purpose of reducing the size of the frame area of ​​the flexible display panel by permanently bending the non-display area of ​​the base substrate in the flexible display panel to the side away from the display panel. [0003] However, for the display panels used in general common equipment, the base substrate is very thin, usually only about 10 μm in thickness,...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52H01L27/32G02F1/1333
CPCG02F1/1333H10K59/131H10K50/844H10K71/00G02F1/133305G02F1/13454H10K77/111H10K2102/311
Inventor 陈立强付文悦
Owner BOE TECH GRP CO LTD
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