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Power module package and manufacturing method thereof

A technology for power modules and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., capable of solving problems such as damage, performance degradation of electronic component modules, and performance degradation of module systems

Inactive Publication Date: 2019-01-04
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the expansion of the application of such power modules, the market demand is increasingly trending toward high integration / high capacity / miniaturization, and the accompanying heat dissipation of electronic components leads to a decrease in the performance of the entire module.
[0004] Usually, high heat is generated during the power conversion process, if the generated heat is not effectively eliminated, it may even lead to performance degradation and damage of the module and the entire system

Method used

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  • Power module package and manufacturing method thereof
  • Power module package and manufacturing method thereof
  • Power module package and manufacturing method thereof

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Embodiment Construction

[0029] The advantages, features and methods for achieving the object of the present invention will be understood through the embodiments described with reference to the accompanying drawings. In this specification, when a reference sign is given to the component of each drawing, the same reference sign represents the same or a similar component throughout this specification. Moreover, if it is considered that the specific description of related known technologies in this specification may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

[0030] Hereinafter, the power module package and its manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

[0031] Figure 1 to Figure 3 To schematically represent a diagram of a power module package 1 according to a preferred embodiment of the present invention, in particular, figure 2 The power module pack...

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Abstract

The invention relates to a power module package and a manufacturing method thereof. The power module package is composed of an upper package part and a lower heat dissipation part. The upper package part has a through hole composed of a first through hole of a heat dissipation substrate and a second through hole of an injection molded component. The rod is inserted into such an upper package to join the upper package and the lower heat sink, and quickly release heat generated in the upper package. Furthermore, in the method of manufacturing the power module package of the present invention, the rod member of the lower heat dissipation part can be inserted into the through hole of the upper package part.

Description

technical field [0001] The invention relates to a power module package and a manufacturing method thereof. Background technique [0002] As the amount of energy usage increases worldwide, great concern is being paid to the efficient use of limited energy resources. As a result, the adoption of inverters to which intelligent power modules (IPMs; Intelligent Power Modules) are applied to efficiently convert (convert) energy is accelerated in existing home appliances and / or industrial products. [0003] With the expansion of applications of such power modules, the market demand tends to be more and more integrated / high-capacity / miniaturized, and the accompanying problem of heat dissipation of electronic components leads to a decrease in the performance of the entire module. [0004] Usually, high heat is generated during the power conversion process, and if the generated heat is not effectively eliminated, it may even lead to performance degradation and damage of the module an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/31H01L21/56
CPCH01L2924/181H01L2924/1815H01L2224/48091H01L2224/48137H01L2224/48247H01L2924/13055H01L2924/00014H01L2924/00012H01L2924/00H01L24/44H01L21/565H01L23/28H01L23/3672H01L23/3675H01L23/495
Inventor 韩京昊朱龙辉张范植
Owner SAMSUNG ELECTRO MECHANICS CO LTD