Method for manufacturing OLED module having heat dissipation function, and heat dissipation structure

Abstract

The present invention discloses a method for manufacturing an OLED module having the heat dissipation function, and a heat dissipation structure. The method comprises the steps of providing an OLED module; providing a heat dissipation film and arraying a plurality of engraved grooves in the attachment surface of the heat dissipation film; filling an adhesive inside the plurality of engraved grooves; and attaching the heat dissipation film onto the OLED module by the adhesive so as to enable the attachment surface of the heat dissipation film to be in direct contact with the OLED module. According to the invention, the engraved grooves are uniformly distributed onto the attachment surface of the heat dissipation film in a net shape, and the adhesive is filled inside the engraved grooves. Meanwhile, the smoothness of the attaching surface of the adhesive and the smoothness of the attachment surface of the heat dissipation film are maintained at the same time. The heat dissipation film is attached onto the back surface of the OLED module. In this way, the attachment surface of the heat dissipation film, not filled by the adhesive, can be in direct contact with the OLED module. Therefore, the condition in the prior art that the heat cannot be effectively and quickly dissipated due to the obstruction of the adhesive as a heat-resistant material all over an entire plane between the OLED module and the heat dissipation film can be effectively avoided. Moreover, the heat can be quickly and evenly dispersed all over the entire back surface of the OLED module.

Description

technical field [0001] The invention relates to OLED module technology, in particular to a manufacturing method and a heat dissipation structure of an OLED module with heat dissipation function. Background technique [0002] The heating of the OLED module is serious, especially at the IC side, so it is necessary to attach a heat dissipation material on the back of the OLED module to distribute the heat evenly on the back of the entire module to avoid local aging too quickly It leads to various defects such as abnormal display of the module. At present, considering the heat dissipation performance and cost, refer to figure 1 As shown, the traditional solution is to attach an entire copper foil layer 22 on the back of the OLED module 21. Since the copper foil layer 22 itself is not sticky, the copper foil layer 22 is attached to the module 21 through the adhesive layer 23. back. [0003] The copper foil layer 22 is attached to the module 21 through the adhesive layer 23 in ...

AI Technical Summary

Problems solved by technology

[0003] The copper foil layer 22 is attached to the module 21 through the adhesive layer 23 in the middle. Since the adhesive layer 23 does not have thermal conductivity and is a heat-resistant material, this structure allows the module 21 to transmit heat to the copper foil layer 22. Blocked by the adhesive layer 23, the conduction of heat is affected to a certain extent, which is not conducive to quickly dispersing the heat on the back of the entire module 21

Images