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A mold for integral molding of sole and upper and shoe manufacturing process thereof

A mold and bottom mold technology, applied in the field of mold and shoe manufacturing technology, can solve problems such as weak bonding, uneven manual operation force, time-consuming and labor-intensive, etc., to reduce human operation errors, improve operation flexibility, and improve manufacturing efficiency. The effect of shoe quality

Active Publication Date: 2019-08-16
MAOTAI FUJIAN SOLES CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As we all know, shoes are mainly composed of soles and uppers. The traditional shoemaking method is to make soles and uppers separately through their own molds, then glue the fabric and soles together, and finally add the inner lining to become finished shoes; In the shoemaking process, the bonding of the sole and the upper requires manual bonding. This manual bonding method is cumbersome, time-consuming, labor-intensive, low in production efficiency, and high in labor costs. Large, high rate of defective products; In addition, the volatilization of glue components during the compounding process will pollute the environment, which is not environmentally friendly and will cause great harm to the health of workshop workers, and the soles and shoes bonded together by glue surface, the bond is not firm, it is easy to degumming and delamination when exposed to water, the service life of the shoe is short, and the product quality is poor

Method used

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  • A mold for integral molding of sole and upper and shoe manufacturing process thereof
  • A mold for integral molding of sole and upper and shoe manufacturing process thereof

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Embodiment Construction

[0018] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0019] refer to Figure 1 to Figure 2 , the embodiment of the present invention discloses that a mold for the integral molding of shoe soles and shoe uppers includes a mold upper cover 1 and a bottom mold 2, and the mold upper cover 1 is provided with a shoe last 11 for shoe uppers to be inserted and fixed. The shoe last 11 is connected to the mold upper cover 1 through the last fixing bolt 12; the bottom mold 2 is provided with a sole cavity for fixing the sole, and the shoe last 11 can be pressed into the sole cavity; the mold A mold middle plate 3 is provided between the upper cover 1 and the bottom mold 2, and the mold middle plate 3 is provided with a cavity for the shoe last to penetrate. The cavity is adapted to the shape of the shoe last, and the size of the cavity is Smaller than the size of the sole cavity; a positioning peg plate 4 is als...

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Abstract

The invention relates to a mold and provides a mold for integrally forming soles and uppers and a production process of shoes. By use of the die for integrally forming the soles and the uppers, the soles and vamps are integrally formed without manual gluing, so that the production efficiency is improved, the production cost is reduced, and the yield and the quality of products are improved; and meanwhile, the pollution of glue to the environment and the harm to bodies of workers are avoided.

Description

technical field [0001] The invention relates to a mold, in particular to a mold for integrally forming shoe soles and shoe uppers and a shoe manufacturing process thereof. Background technique [0002] Shoes are a necessity on people's body and are an important tool for people to protect the safety of their feet. As we all know, shoes are mainly composed of soles and uppers. The traditional shoemaking method is to make soles and uppers separately through their own molds, then glue the fabric and soles together, and finally add the inner lining to become finished shoes; In the shoemaking process, the bonding of the sole and the upper requires manual bonding. This manual bonding method is cumbersome, time-consuming, labor-intensive, low in production efficiency, and high in labor costs. Large, high rate of defective products; In addition, the volatilization of glue components during the compounding process will pollute the environment, which is not environmentally friendly an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29D35/06
CPCB29D35/065
Inventor 丁思恩郑荣大庄伟志郑艺文庄鸿彬卢鑫
Owner MAOTAI FUJIAN SOLES CO LTD
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