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Chemical nickel plating bath and chemical plating method using same

A technology of electroless nickel plating and nickel salt, which is applied in the direction of liquid chemical plating, metal material coating technology, coating, etc., and can solve the problems of easy deterioration of the appearance of the coating film and aging of the electroless nickel plating bath, etc.

Active Publication Date: 2016-10-12
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the electroless nickel plating method, due to the influence of the bottom layer of the electrode, that is, the metal layer, or the melting and mixing of metals, the electroless nickel plating bath will age, and the appearance of the plating film will easily deteriorate.

Method used

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  • Chemical nickel plating bath and chemical plating method using same
  • Chemical nickel plating bath and chemical plating method using same
  • Chemical nickel plating bath and chemical plating method using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0076] The weight-average molecular weight is about 15000 and the gloss agent represented by formula (I), S type additives namely TDA and Pb are added in the above-mentioned basic components to prepare the electroless nickel plating bath, and the electroless nickel plating bath is designated as embodiment 2 . Make R in formula (I) 1 for-CONCH 3 , so that R 2 for -CH 2 -NH-CONH 2 (Refer to Table 2).

Embodiment 3

[0078] The weight-average molecular weight is about 20000 and the gloss agent represented by formula (I), S type additives namely TDA, and Pb are added in the above-mentioned basic components to prepare an electroless nickel plating bath, and the electroless nickel plating bath is designated as embodiment 3 . Make R in formula (I) 1 for -CH 2 -NHCOCH 3 , so that R 2 for -CH 2 -NH-CONH 2 (Refer to Table 2).

Embodiment 4

[0080] The weight-average molecular weight is about 15000 and the gloss agent represented by formula (I), S type additives namely TDA, and Pb are added in the above-mentioned basic components to prepare an electroless nickel plating bath, and the electroless nickel plating bath is designated as embodiment 4 . Make R in formula (I) 1 for -CH 2 -NH 2 , so that R 2 for -CH 2 -NH-CONH 2 (Refer to Table 2).

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Abstract

The invention discloses a chemical nickel plating bath. Even if the bottom is uneven, the chemical nickel plating bath can form a uniform and lustrous nickel plated membrane. The chemical nickel plating bath contains water soluble nickel salts, a gloss agent formed by polymers taking carbamido as the side chain, monosulfide additives, and lead ions.

Description

technical field [0001] The technology disclosed in the present invention relates to an electroless nickel plating. Background technique [0002] Electroless nickel plating can be used in electronic components, automobile parts, etc., and has a wide range of uses. For example, when forming a bump (bump) etc. on an electrode on a semiconductor wafer to be bonded to other semiconductor chips, etc., a bottom barrier metal layer (UBM) made of nickel (Ni) or the like is formed by electroless plating before forming the bump. : Under Barrier Metal). [0003] In the technology for forming UBM, stable formation of a plated film with a uniform film thickness is desired when forming an electroless nickel plating film. In addition, the appearance of the plating film is also required to be good. [0004] However, in the electroless nickel plating method, the electroless nickel plating bath deteriorates due to the influence of the metal layer, which is the bottom layer of the electrode,...

Claims

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Application Information

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IPC IPC(8): C23C18/32
CPCC23C18/1642C23C18/32
Inventor 野村胜矩小田幸典稻川扩柴田利明
Owner C UYEMURA & CO LTD