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Flexible electronic module and manufacturing method thereof

A technology of electronic modules and manufacturing methods, which is applied in the fields of printed circuit manufacturing, electronic switches, printed circuits, etc., can solve problems such as inability to expand and contract, and achieve the effect of increasing applicability

Active Publication Date: 2016-10-12
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these flexible electronic products still have certain restrictions on deformation. For example, although they are bendable and bendable, they still cannot be stretched, which makes the application of such flexible electronic products still have some limitations.

Method used

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  • Flexible electronic module and manufacturing method thereof
  • Flexible electronic module and manufacturing method thereof
  • Flexible electronic module and manufacturing method thereof

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Embodiment Construction

[0081] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0082] figure 1 It is a schematic cross-sectional view of a flexible electronic module according to an embodiment of the present invention. Please refer to figure 1 The flexible electronic module 100 of this embodiment includes a patterned flexible substrate 110, a stretchable material layer 120 and at least one electronic component 130 (in figure 1 In the figure, a plurality of electronic components 130 are taken as an example). The patterned flexible substrate 110 includes at least one distribution area 112 (in figure 1 In the figure, multiple distribution areas 112 are taken as an example), and the stretchable material layer 120 connects the distribution areas 112 . The electronic component 130 is disposed on at least one of the patterned flexible substrate 110 and the stretchable mater...

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Abstract

The invention discloses a flexible electronic module, which includes a patterned flexible substrate, a stretchable material layer, and at least one electronic device. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Description

technical field [0001] The present invention relates to an electronic module and its manufacturing method, and in particular to a flexible electronic module and its manufacturing method. Background technique [0002] In order to achieve the stability of electrical quality and the reliability and durability of conductive circuits in traditional electronic products, electronic components are usually made on hard substrates, which can prevent the quality of conductive circuits from being affected by deformation of electronic products Or even break the conductive line or damage the chip. However, fabricating electronic components on a rigid substrate will greatly limit the applicability of electronic products. For example, an electronic product that is too large will be difficult to carry around, difficult for users to wear, and inconvenient to store. In addition, it is also difficult for such electronic products to be closely attached to parts with curved surfaces of human be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0283H03K17/9622H03K2217/960755H05K1/189H05K3/007H05K3/284H05K2201/0187H05K2201/0191H05K2201/05
Inventor 张志嘉杨明桓李正中何家充蔡镇竹庄坤霖
Owner IND TECH RES INST