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A communication circuit board chip automatic feeding and pressing down fixing mechanism

A technology of automatic feeding and fixing mechanism, which is applied in printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc. It can solve the problems of low position accuracy and low efficiency, and achieve the effect of fast bonding and accurate position

Active Publication Date: 2018-08-24
浙江晶引电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] There are circuit boards inside the existing communication equipment, etc., and various chips are fixed on the circuit board to realize the functions required by the communication equipment. Some of the chips are bonded and fixed on the circuit board, and then welded with wire. Realize the fixation of the chip, while the existing adhesive fixation is fixed manually, which has low efficiency and low position accuracy

Method used

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  • A communication circuit board chip automatic feeding and pressing down fixing mechanism
  • A communication circuit board chip automatic feeding and pressing down fixing mechanism
  • A communication circuit board chip automatic feeding and pressing down fixing mechanism

Examples

Experimental program
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Effect test

Embodiment Construction

[0021] Examples, see e.g. Figure 1 to Figure 4 As shown, a communication circuit board chip automatic feeding and pressing down fixing mechanism includes a frame 100, the two sides of the top plate 101 of the frame 100 are fixed with connection plates 11, and the connection plate 11 is fixed with a push cylinder 12, which pushes the cylinder The push rod of 12 stretches out connecting plate 11 and is fixed with clamping block 13, and the middle part of top plate 101 is fixed with circuit board placement plate 102, and the middle part of circuit board placement plate 102 is fixed with cushion layer 103, and two clamping blocks 13 are in The left and right sides of the cushion layer 103; one side of the frame 100 is fixed with a feeding frame 200, and the bottom surface of the upper top plate of the feeding frame 200 is fixed with a lifting cylinder 30, and the push rod of the lifting cylinder 30 passes through vertically The top plate of the frame 100 is also fixed with a lift...

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PUM

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Abstract

The invention discloses an automatic feeding, pressing and fixing mechanism of a communication circuit board chip. The automatic feeding, pressing and fixing mechanism comprises a rack, wherein connecting plates are fixed at two sides of a top plate of the rack; a push air cylinder is fixed on each connecting plate; a push rod of each push air cylinder extends outside the corresponding connecting plate and is fixed with a clamping block; a circuit board placement plate is fixed at the middle part of the top plate; a buffer cushion layer is fixed at the middle part of the circuit board placement plate; two clamping blocks are located on the left side and the right side of the buffer cushion layer; a feeding rack is fixed at one side of the rack; a lifting air cylinder is fixed on the bottom surface of an upper top plate of the feeding rack; a push rod of the lifting air cylinder vertically passes through the top plate of the rack upwards and is fixed with a lifting plate body; a rotary air cylinder is fixed on the top surface of the lifting plate body; a feeding plate is fixed on a rotating shaft of the rotary air cylinder; a feeding air cylinder is fixed on the feeding plate; and a feeding tray is fixed on the push rod of the feeding air cylinder. The chip can be automatically conveyed to a suction cup and is automatically bonded to and fixed to the circuit board, so that bonding is fast and the position is accurate.

Description

Technical field: [0001] The invention relates to the technical field of communication equipment, and more specifically relates to a communication circuit board chip automatic feeding pressing down fixing mechanism. Background technique: [0002] There are circuit boards inside the existing communication equipment, etc., and various chips are fixed on the circuit board to realize the functions required by the communication equipment. Some of the chips are bonded and fixed on the circuit board, and then welded with wire. To realize the fixation of the chip, while the existing adhesive fixation is all fixed manually, which has low efficiency and low position accuracy. Invention content: [0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide a communication circuit board chip automatic feeding and pressing down fixing mechanism, which can automatically transport the chip to the suction cup for automatic bonding and fixing on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30H05K13/04
CPCH05K3/305H05K13/0408H05K2203/0195
Inventor 王文庆
Owner 浙江晶引电子科技有限公司