Array substrate, manufacturing method thereof and display device

Abstract

The embodiment of the invention discloses an array substrate, a manufacturing method thereof and a display device, and relates to the technical field of touch displaying. The load difference between touch electrodes can be reduced or removed, and the product yield can be increased. The array substrate comprises a substrate body, touch electrodes and signal lines corresponding to the touch electrodes in a one-to-one mode. The signal lines comprise first sub-signal lines and second sub-signal lines; the first sub-signal lines are electrically connected with a touch-signal detection circuit, the first sub-signal lines are electrically connected with the second sub-signal lines through a first conductive structure, and the second sub-signal lines are electrically connected with the touch electrodes through a second conductive structure; the line lengths generated when touch signals generated by the touch electrodes on the array substrate are transmitted to the touch-signal detection circuit on the corresponding signal lines are equal, wherein the line lengths generated when the touch signals are transmitted to the touch-signal detection circuit on the corresponding signal lines are the sum of the transmission lengths of the touch signals on the first sub-signal lines and the second sub-signal lines.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of touch display, and in particular, to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] In the field of display technology, with the development of technology, various touch display panels with embedded touch electrodes have appeared. One of the existing FIC (English: full in cell, a touch electrode embedded touch panel) Panel) products use an equal capacitance design. In this design, the touch electrode can be a transmitting electrode (TX) or a receiving electrode (RX). All TX electrodes are connected to two signal lines, and the two signal lines form a capacitor. In the manufacturing process, try to ensure that the lengths of the two signal lines connected to all TX electrodes are the same, and then try to ensure the same capacitance or maximize the elimination of capacitance differences. This can reduce the load (load) differenc...

AI Technical Summary

Problems solved by technology

[0002] In the field of display technology, with the development of technology, various touch display panels with embedded touch electrodes have appeared. One of the existing FIC (English: full in cell, a touch electrode embedded touch panel) Panel) products use an equal capacitance design. In this design, the touch electrode can be a transmitting electrode (TX) or a receiving electrode (RX). All TX electrodes are connected to two signal lines, and the two signal lines form a capacitor. In the manufacturing process, try to ensure that the lengths of the two signal lines connected to all TX electrodes are the same, and then try to ensure the same capacitance or maximize the elimination of capacitance differences. This can reduce the load (load) difference between electrodes, but cannot eliminate the difference. , for example, because the TX electrodes are connected to the touch signal detection circuit (which may be an integrated circuit IC, English full name: Integrated Circuit) through signal lines in the prior art, and because the positions of the TX electrodes on the display panel are different, different TX The lengths of the signal lines connected to the electrodes are also different, so the resistance of the signal lines connected to each TX electrode is still very different. The above is just an example of a current technology. Among other touch products on the market, adopt Similar structures also have the problem that the resistance of the signal lines connected to each TX electrode is very different, which will bring a series of problems, such as the capacitance value caused by the difference in capacitance value spec out (exceeding the capacitance value), Short ( short circuit), Open (open circuit) and other defects, which greatly reduce product yield and affect product promotion

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