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Method and apparatus for vacuum prewetting circuit board

A circuit board and vacuum technology, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as limited effectiveness

Inactive Publication Date: 2016-10-26
TAIWAN ADVANCED SYST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its effect is limited. In the actual process, the complete filling and flat coverage of electrolytic copper is still a major challenge at present.

Method used

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  • Method and apparatus for vacuum prewetting circuit board
  • Method and apparatus for vacuum prewetting circuit board

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Embodiment Construction

[0021] Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily understand. The described creation can be implemented in various variations, but should not be limited to these examples. The present invention omits descriptions of well-known parts, and the same reference numerals denote the same elements in the present invention.

[0022] figure 1 Shown is a flow chart of the vacuum prewetting method for the circuit board according to the embodiment of the present invention. The vacuum pre-wetting method is applicable to the pre-wetting step of a circuit board process, and is operated in conjunction with a vacuum pre-wetting device; the method includes the following steps: Step 110 is to place at least one circuit board to be pre-wetted into the vacuum pre-wetting device ; Step 120 is to start vacuuming the vacuum moistening device. Before vacuuming, an air p...

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Abstract

One embodiment of the invention discloses a method and apparatus for vacuum prewetting a circuit board. The method comprises following steps: placing a circuit board to be pre-wetted into a vacuum apparatus; evacuating the vacuum apparatus; when the pressure in the vacuum device is less than a pressure threshold, the deionized water (DIW) is injected; when the deionized water to be injected completely covers the circuit board, stopping the injection of deionized water and standing for a preset period of time; when the preset time is reached, the vacuum is released, the deionized water is allowed to flow out, and the circuit board is taken out.

Description

technical field [0001] The invention relates to a vacuum pre-wetting method and device for a circuit board. Background technique [0002] With the demand for increased functions of electronic products and the development of mobile technology, the miniaturization of printed circuit boards (or circuit boards for short) and related semiconductor circuits has become the research focus of many technicians engaged in development in recent years; inevitably , The miniaturization of circuit boards also faces many technological difficulties. For example, the copper plating (copper plating) step commonly used in the circuit board process. The current common technology is to immerse the circuit board in the copper plating solution (copper plating solution), and then fill the electrolytic copper (electrolytic copper) into the micro via (micro via) on the circuit board through electrolysis. Plated through holes (PTH), high aspect ratio (AR) copper pillars or evenly and flatly cover a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/38
CPCH05K3/0088H05K3/381H05K2203/0776
Inventor 王彦智洪俊雄
Owner TAIWAN ADVANCED SYST CORP