A communication circuit board chip pressing and fixing mechanism
A technology of fixing mechanism and circuit board, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of low position accuracy and low efficiency, and achieve the effect of fast bonding and accurate position
Active Publication Date: 2018-08-17
浙江晶引电子科技有限公司
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] There are circuit boards inside the existing communication equipment, etc., and various chips are fixed on the circuit board to realize the functions required by the communication equipment. Some of the chips are bonded and fixed on the circuit board, and then welded with wire. Realize the fixation of the chip, while the existing adhesive fixation is fixed manually, which has low efficiency and low position accuracy
Method used
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Embodiment Construction
[0017] Examples, see e.g. Figure 1 to Figure 2 As shown, a communication circuit board chip pressing and fixing mechanism includes a frame 100, the two sides of the top plate 101 of the frame 100 are fixed with connecting plates 11, the connecting plates 11 are fixed with a push cylinder 12, and the push cylinder 12 The push rod extends out of the connecting plate 11 and is fixed with a clamping block 13. The middle part of the top plate 101 is fixed with a circuit board placement plate 102, and the middle part of the circuit board placement plate 102 is fixed with a cushion layer 103. The two clamping blocks 13 are placed on the cushion pad. On the left and right sides of the layer 103, a plurality of support columns 14 are fixed on the top plate 101, the upper ends of the support columns 14 are fixed on the lower plane of the upper support plate 15, and the middle part of the bottom surface of the upper support plate 15 is fixed with a rotary cylinder 20. The rotating shaft...
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The invention discloses a chip down-pressing and fixing mechanism of a communication circuit board. The chip down-pressing and fixing mechanism comprises a rack; connecting plates are fixedly arranged at the two sides of the top plate of the rack; pushing cylinders are fixedly arranged on the connecting plates; the push rod of each pushing cylinder stretches out of each connecting plate and is fixedly provided with a clamping block; the middle part of the top plate is fixedly provided with a circuit board placing plate; a buffering cushion layer is fixedly arranged at the middle part of the circuit board placing plate; the two clamping plates are located at the left and right of the buffering cushion layer; multiple support posts are fixedly arranged on the top plate; the upper end of each support post is fixedly arranged at the lower plane of an upper support plate; a rotary cylinder is fixedly arranged at the middle part of the bottom surface of the upper support plate; the rotating shaft of the rotary cylinder is vertically downward and is fixedly provided with a rotating disc; a feeding cylinder is fixedly arranged at one side of the rotating disc and a down-pressing cylinder is fixedly arranged at the other side of the rotating disc; the push rod of the feeding cylinder is vertically downward and is fixedly provided with a sucking disc; and a gas pipe connector is arranged at the sidewall of the push rod of the feeding cylinder in a communicative manner. The chip down-pressing and fixing mechanism of the communication circuit board can fixedly adhere a chip to the circuit board automatically, the adhering speed is fast and the adhering position is accurate.
Description
Technical field: [0001] The invention relates to the technical field of communication equipment, and more specifically relates to a communication circuit board chip pressing and fixing mechanism. Background technique: [0002] There are circuit boards inside the existing communication equipment, etc., and various chips are fixed on the circuit board to realize the functions required by the communication equipment. Some of the chips are bonded and fixed on the circuit board, and then welded with wire. To realize the fixation of the chip, while the existing adhesive fixation is all fixed manually, which has low efficiency and low position accuracy. Invention content: [0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide a communication circuit board chip pressing and fixing mechanism, which can automatically bond and fix the chip on the circuit board, and the bonding is fast and the position is accurate. [0004] The sch...
Claims
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IPC IPC(8): H05K3/30
CPCH05K3/305H05K2201/10212
Inventor 王文庆
Owner 浙江晶引电子科技有限公司