Rubber-band-based three-dimensional circuit automatic wiring method applicable to electromechanical integrated products

Abstract

The invention discloses a rubber-band-based three-dimensional circuit automatic wiring method applicable to electromechanical integrated products and belongs to the technical field of electromechanical integration. The method includes: performing triangular meshing; creating an initial three-dimensional search graph; using a corrected A* algorithm to search the shortest path one by one; correspondingly updating the three-dimensional search graph whenever one path is searched so as to prevent subsequent searched paths from intersecting with the path; updating the point adjacent information at the starting and ending triangular edges where the path is located, and updating points of edges passed by the path and adjacent information; by the areas formed by the series of triangles passed by the paths searched by the A* algorithm, forming a channel; using a channel algorithm to find a rubber band corresponding to each path, wherein the rubber band is a fold line connected by the path starting point, path ending point and bypassed barrier points; creating corresponding Spokes for each rubber band, and guaranteeing the shortest distance between paths or shortest distance between the path and a barrier so as to obtain an expanded rubber band, namely the three-dimensional path.

Description

technical field [0001] The invention belongs to the technical field of mechatronics, and relates to a three-dimensional circuit automatic wiring design method, in particular to a three-dimensional circuit automatic wiring method based on rubber bands used in electromechanical integrated products. Background technique [0002] In the field of mechatronics, an innovative process technology 3D-MID (Three Dimensional-Molded Interconnect Devices, three-dimensional molded interconnect devices or three-dimensional electromechanical integrated devices) technology [1] , Abandoning the traditional circuit board and directly integrating mechanical and electronic functions on the three-dimensional matrix material has opened up a broader road for the new design of mechatronic devices using limited space. This way of integrating mechanical and electronic functions directly on materials involves the requirement for three-dimensional circuit design. [0003] The wiring problem is NP-hard. ...

AI Technical Summary

Problems solved by technology

The SURF wiring system works better in PCB plane wiring, but it still does not break through the limitations of the three-dimensional solid structure, and cannot realize automatic wiring on the three-dimensional substrate

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