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Adhesive film bonding method

A bonding method and adhesive film technology, which is applied in the direction of electrical components, laminated printed circuit boards, printed circuit manufacturing, etc., can solve problems such as poor consistency, large errors, and complicated processes, and achieve the effect of poor consistency

Active Publication Date: 2016-11-09
XIAN FLIGHT SELF CONTROL INST OF AVIC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this invention is to propose a new adhesive film bonding method to solve the problems of complex procedures, poor consistency, and large errors in the bonding process of large-scale printed boards.

Method used

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Embodiment Construction

[0021] A bonding method of an adhesive film is characterized in that the realization steps of the method are as follows:

[0022] 1. Design the adhesive film cold and hot adhesive tooling. The adhesive film cold and hot adhesive tooling is a rectangular steel plate structure, which is divided into upper and lower layers. The upper layer is a rectangular upper platen 1, and the lower layer is a rectangular base 2; the shape of the upper platen 1 and base 2 match;

[0023] 2. There is a positioning hole 5 at the four corners of the upper platen 1;

[0024] 3. The base 2 is respectively provided with 4 reference positioning pins 3 and 4 anti-offset positioning pins 4; the 4 reference positioning pins 3 are respectively locked with the reserved holes of the locking strip of the printed board and the reserved film. The positions of the bar holes correspond to each other; the four anti-offset positioning pins 4 correspond to the positions of the positioning holes 5 at the four corn...

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Abstract

The invention provides an adhesive film bonding method belonging to the technical field of electronic assembly. The invention provides a method quickly bonding adhesive films. Through usage of a special adhesive film bonding tool, the method realizes quick positioning between an adhesive film and a heat radiating plate and a printed board and reduces the number of bondings. The adhesive film bonding tool is formed by an upper pressure plate (1), a base (2), a reference positioning pin (3), an offset-preventing positioning pin (4), and a positioning hole (5). The method can significantly improve the accuracy of adhesive film bonding and reduce the bonding cycle.

Description

technical field [0001] The invention relates to an adhesive film bonding method, which belongs to the technical field of electronic assembly. Background technique [0002] Printed boards are used in every subject of my institute. Whether it is flight control series, inertial navigation series or other products, almost every series of products has printed boards. However, 90% of the functional printed boards of my research project need to be bonded with a cold plate to play a role in heat dissipation. The heat dissipation of a printed board directly affects the operation of a chassis or even the entire system. Bonding is mainly divided into two parts: cold bonding and hot bonding. The traditional bonding method has complex procedures, poor consistency and large errors. Especially when encountering printed boards with many through-hole devices and small printed boards, it is very easy to cover the cold plate when bonding the cold plate and the pads cannot be found in time, wh...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0058H05K2203/0165
Inventor 姚伟张伟
Owner XIAN FLIGHT SELF CONTROL INST OF AVIC