Device and method for cutting sapphire

A sapphire, body technology, applied in fine working devices, welding/welding/cutting items, stone processing equipment, etc., can solve problems such as large coating damage area

Active Publication Date: 2016-11-09
深圳市大族半导体装备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem of large coating damage area after direct processing of coated sapphire composite materials

Method used

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  • Device and method for cutting sapphire
  • Device and method for cutting sapphire
  • Device and method for cutting sapphire

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Embodiment Construction

[0032] In order to facilitate the understanding of the present invention, the method and device for cutting sapphire will be described more fully below with reference to the relevant drawings. A preferred embodiment of the method and apparatus for cutting sapphire is given in the accompanying drawings. However, the method and apparatus for cutting sapphire can be implemented in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of methods and apparatus for cutting sapphire will be thorough.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the method and apparatus for cutting sapphire are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used...

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Abstract

Provided is a method for cutting a sapphire. The sapphire comprises a sapphire body and a coating formed on the sapphire body. The method comprises following steps: focusing a first CO2 laser beam on the coating through a CO2 focusing assembly to remove the coating of pre-set thickness extending along a first path; removing dust and chippings generated during the process of removing the coating; focusing an ultrafast laser beam to the sapphire body through an optical path shaping assembly in order to form multiple restructuring channels penetrating the sapphire distributed along a second path; scanning the sapphire body by the second C02 laser beam through a galvanometer focusing assembly, and scanning a path the sapphire body which coincides with or deviates from the second path through the galvanometer focusing assembly such that the sapphire cracks along the restructuring channels.

Description

technical field [0001] The invention relates to a method and device for cutting sapphire. Background technique [0002] Because of its high hardness, scratch resistance, high temperature resistance and good chemical stability, sapphire is used as a window for precision instruments, precision parts and LED (Light Emitting Diode, light emitting diode) substrates. With the vigorous development of the consumer electronics market in recent years, the application of sapphire in the consumer electronics field shows a trend of sharp increase. Glass materials such as mobile phone screens, cameras, return keys, and fingerprint recognition modules are gradually replaced by sapphire. [0003] The traditional sapphire processing technology is to process sapphire bare chips, followed by other coating processes, so the sapphire processing technology is cumbersome and inefficient. With the continuous improvement of market requirements, sapphire processing gradually appears to directly pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/53B23K26/142B23K26/064
CPCB23K26/064B23K26/142B23K26/53B23K26/06B23K2101/40B23K26/361B23K26/0624B23K2103/50B23K26/0821B23K26/0006B23K26/0604B23K26/16B28D5/0011
Inventor 苑学瑞张小军刁凌天彭裕国卢建刚柳啸马国东唐建刚尹建刚高云峰
Owner 深圳市大族半导体装备科技有限公司
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