Packaging structure comprising interconnected embedded chips and flip chips and manufacturing method of packaging structure

Abstract

The invention discloses a packaging structure comprising interconnected embedded chips and flip chips and a manufacturing method of the packaging structure. The packaging structure comprises a substrate and at least one chip I, wherein at least one groove is formed in the substrate; a functional surface of each chip I is upwards embedded into the corresponding groove; the embedded chip I and the surface on which the substrate is located form an approximate plane; an insulating layer is formed on the plane; at least one rewiring layer is formed on the insulating layer; at least one chip II is interconnected to the plane in an inverted manner; and a first conductive structure is also formed on the plane. The at least one chip is embedded into the substrate, and at least one flip chip is electrically interconnected to the embedded chip and the plane in which the substrate is located, so that a plurality of chips can be electrically interconnected, the chip packaging volume is reduced, the process is simple, the packaging structure can be achieved by employing a mature manufacturing technology, and meanwhile, a product is high in yield and good in reliability. The invention further discloses a manufacturing method of the packaging structure.

Description

technical field [0001] The invention relates to a packaging structure in the field of semiconductor chip packaging, in particular to a packaging structure including embedded chips and flip-chip interconnections and a manufacturing method thereof. Background technique [0002] Chip packaging technology is a process technology that wraps the chip to avoid contact between the chip and the outside world and prevent damage to the chip from the outside world. Impurities and bad gases in the air, and even water vapor will corrode the precision circuits on the chip, resulting in a decrease in electrical performance. Different packaging technologies differ greatly in terms of manufacturing processes and processes, and packaging also plays a vital role in the performance of the memory chip itself. With the rapid development of optoelectronic and microelectronic manufacturing technology, electronic products are always developing in the direction of smaller, lighter and cheaper, so the...

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Problems solved by technology

[0003] Chinese patent 200410015872.4, a multi-chip integrated circuit packaging method and its structure, discloses a multi-chip packaging process. The chip packaging structure mentioned in the process can effectively increase the number of chip packages and has good heat dissipation performance, but Its packaging space has not been fully utilized, and due to the limitation of the packaging structure, the number of packages of its chips is limited

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