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Fitting equipment

A technology for bonding equipment and cavities, applied in lamination devices, instruments, electrical digital data processing, etc., can solve problems such as increasing processing time, achieve the effects of improving quality, improving processing efficiency, and avoiding air bubbles

Active Publication Date: 2018-08-10
TRENDON TOUCH TECHNOLOGY CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the lower cavity of the prior art can only accommodate a single carrier, and the calibration module is arranged outside the lower cavity, the calibration module can only perform position correction on a single carrier in a single lower cavity
Therefore, since the alignment compensation platform can only bond a single touch layer module at a time, the processing time will be greatly increased

Method used

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Examples

Experimental program
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Embodiment Construction

[0051] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0052] The bonding equipment of the present invention is used for bonding two films. For example, two thin films can be combined into a touch module group. However, the above examples are not intended to limit the present invention. In other embodiments, the two thin films can be combined into a film layer group with other functions.

[0053] The bonding equipment of an embodiment is introduced below, please refer to Figure 1 to Figure 3 . figure 1 It is a three-dimensional schematic diagram of a bonding device according to an embodiment of the present invention. figure 2 for figure 1 The cross-sectional schematic diagram of the carrier table, calibration module and vacuum device of the bonding equipment. image 3 for figure 1 Schematic side view of the fitting device.

[0054] The laminating equipment 1 of this embo...

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PUM

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Abstract

Attaching equipment comprises a lower cavity, multiple bearing tables, multiple correction modules, an upper cavity and a detection device. The lower cavity is provided with a containing space and an opening which is made communicated with the containing space. The bearing tables are located in the containing space. The correction modules are connected with the bearing tables, and therefore the bearing tables move relative to the lower cavity. The upper cavity is provided with a plate body and fixed discs fixed to the plate body. The plate body is movable so as to be provided with a first position and a second position. When the plate body is at the first position, the plate body is a first distance away from the lower cavity. When the plate body is at the second position, the plate body covers the opening so as to close the containing space, and the fixed discs correspond to the bearing tables respectively. The detection device is movably arranged near the lower cavity. When the plate body is at the first position, the detection device detects the relative position of each bearing table and the corresponding fixed disc, the correction modules drive the bearing tables to move, and therefore the bearing tables are aligned to the fixed discs.

Description

technical field [0001] The invention relates to a bonding device, in particular to a bonding device with a plurality of carrying platforms. Background technique [0002] In recent years, with the advancement of technology, many electronic devices, such as tablet computers, smart phones, All-In-One Computers (All-In-One Computers), digital cameras, watches, music players or handheld game consoles, etc., can carry a The touch display panel allows the user to input signals to the electronic device through touch. In this way, the user can interact with the electronic device without using other input devices such as a mouse or a keyboard. In this way, the volume and weight of the electronic device can be greatly reduced because no mouse or keyboard is required. [0003] Generally, the touch display panel includes a touch layer module, which is formed by laminating multiple layers of films. In the current bonding process, a single alignment stage is mainly used for bonding. Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12G06F3/041
Inventor 吴育贤蓝啟仁陈建维廖伟全
Owner TRENDON TOUCH TECHNOLOGY CORPORATION