Fitting equipment
A technology for bonding equipment and cavities, applied in lamination devices, instruments, electrical digital data processing, etc., can solve problems such as increasing processing time, achieve the effects of improving quality, improving processing efficiency, and avoiding air bubbles
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[0051] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
[0052] The bonding equipment of the present invention is used for bonding two films. For example, two thin films can be combined into a touch module group. However, the above examples are not intended to limit the present invention. In other embodiments, the two thin films can be combined into a film layer group with other functions.
[0053] The bonding equipment of an embodiment is introduced below, please refer to Figure 1 to Figure 3 . figure 1 It is a three-dimensional schematic diagram of a bonding device according to an embodiment of the present invention. figure 2 for figure 1 The cross-sectional schematic diagram of the carrier table, calibration module and vacuum device of the bonding equipment. image 3 for figure 1 Schematic side view of the fitting device.
[0054] The laminating equipment 1 of this embo...
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