Wind shield

Abstract

The invention provides an air guide cover which is used for mounting an electronic device. The electronic device comprises a first processor assembly and a second processor assembly. The air guide cover comprises: a first air guide part, a second air guide part and a flow splitting structure, wherein the first air guide part is mounted above the first processor assembly and a gap is formed between the first air guide part and the first processor assembly; the second air guide part is mounted above the second processor assembly; the flow splitting structure is located between the first air guide part and the second air guide part and comprises a first flow splitting part and a second flow splitting part; the first flow splitting part comprises an air guide hole and the air guide hole is communicated with the gap and the second air guide part respectively and air conveyed from the gap is guided into the second processor assembly from the air guide hole; and the second flow splitting part is arranged below the air guide hole and is located between the first processor assembly and the second processor assembly, so that the air penetrating through the first processor assembly does not flow through the second processor assembly. Therefore, the temperature of the second processor assembly can be effectively reduced.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic devices, in particular to an air guide cover. Background technique [0002] With the rapid development of cloud computing and big data, the current server applications require higher and higher computing performance, resulting in the need to configure more processors and memory in the same space to improve computing performance. So now servers, especially single-board motherboards on blade servers have at least two processors, and the maximum number of memory modules are usually configured on both sides of the processor. Due to the limitation of layout and interconnection wiring, the two CPUs are usually arranged front-to-back. When the wind from the fan blows from the front to the back, the wind passes through the front processor to the rear processor, resulting in poor heat dissipation of the rear processor. [0003] The air duct can be used to distribute different air volumes to d...

AI Technical Summary

Problems solved by technology

[0004] However, due to the cascading relationship between the front and rear CPUs, the hot air passing through the front CPU will pass through the rear CPU, which still cannot completely eliminate the thermal coupling effect of the front CPU on the rear CPU.

When the fan speed is fixed, the temperature of the front and rear CPUs can be controlled more evenly by controlling the ventilation space of the CPU upstream of the air duct. However, as the fan speed changes, the temperature difference between the front and rear CPUs will still increase.

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