Fingerprint identification module and terminal

A fingerprint recognition module, frame technology, applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, chemical instruments and methods, etc. The effect of ensuring electrical continuity

Active Publication Date: 2016-11-23
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the overall nickel plating of the metal ring in the fingerprint recognition module, the content of lead and cadmium in the nickel plating layer is relatively high, exceeding the EU ROHS (Restriction of Hazardous Substances, instructions on restricting the use of certain harmful ingredients in electronic and electrical equipment) ) instruction on the content of harmful substances, and the nickel released by these products during use may cause skin allergies and even dermatitis of users. Chronic inhalation of nickel in severe cases can lead to degeneration of the heart, brain, liver, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fingerprint identification module and terminal
  • Fingerprint identification module and terminal
  • Fingerprint identification module and terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] see figure 1 , is a schematic structural diagram of a fingerprint identification module provided by an embodiment of the present invention. The fingerprint recognition module includes a circuit board 110 , a fingerprint recognition chip 130 , a metal ring 150 and a conductive substrate 160 . Metal ring 150 has a top surface 151 , a bottom surface 153 , an inner side 154 and an outer side 152 . The circuit board 110 may be a rigid circuit board, a flexible ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The embodiment of the invention discloses a fingerprint identification module comprising a metal ring including a top surface, a bottom surface, an inner side surface, and an outer side surface. The top surface is a highlight surface; PVD layers are arranged on an external surface, the inner side surface, and the outer side surface; and a nickel-plated layer is arranged on the bottom surface. In addition, the embodiment of the invention also discloses a terminal. Therefore, the ground impedance of the fingerprint module can be guaranteed and thus EDS testing can be done successfully.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a fingerprint identification module and a terminal. Background technique [0002] At present, semiconductor devices in electronic products are generally electroplated with a nickel layer on the surface of electronic components to reduce the impedance of electronic components. The metal frame in the existing fingerprint identification module is generally nickel-plated as a whole to ensure that the grounding impedance from the metal frame to the connector steel sheet is less than 5 ohms after the frame is assembled into the module, so as to ensure the electrical conductivity of the fingerprint identification module and Good ESD (Electro-Static discharge, electrostatic discharge) protection effect. [0003] However, due to the overall nickel plating of the metal ring in the fingerprint recognition module, the content of lead and cadmium in the nickel plating layer is relatively ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00B32B15/04B32B3/22
CPCB32B3/18B32B15/04B32B15/043B32B2457/00B32B2307/202G06V40/12
Inventor 陈华周宝华李泽
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap