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A technology for mobile equipment and formations, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc., which can solve the problems of poor heat dissipation and large thermal resistance, and achieve the effect of controlling temperature rise

Active Publication Date: 2017-08-25
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The FPC (abbreviation of Flexible Printed Circuit, also known as flexible circuit board) in the related art connects all the signals through the connection socket, and then directly inserts the connection socket on the motherboard, so that the FPC and the motherboard can only be connected through the connector. And rely on the pad to connect to the motherboard to form heat dissipation, the thermal resistance is large and the heat dissipation effect is poor

Method used

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0026] Combine below figure 1 with figure 2 The mobile device 100 according to the embodiment of the present invention will be described in detail.

[0027] refer to figure 1 with figure 2 , the mobile device 100 according to the embodiment of the present invention includes: a main circuit board 1 and a charging circuit board 2 .

[0028] Specifically, combining figure 2 with figure 1 The main circuit board 1 includes an element layer 11, a first signal layer 12, a main ground layer 13, and a second signal layer 14, and ...

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Abstract

The invention discloses mobile equipment which comprises a main circuit board and a charge circuit board, wherein the main circuit board comprises a component layer, a first signal layer, a main ground layer and a second signal layer, wherein the component layer, the first signal layer, the main ground layer and the second signal layer are sequentially overlapped; the charge circuit board comprises a wiring layer and a ground plane layer; at least one part of the wiring layer is overlapped with at least one part of the ground plane layer; the wiring layer is connected with the component layer of the main circuit board; and the ground plane layer is connected with the main ground layer of the main circuit board. In the mobile equipment disclosed by the invention, by connecting the wiring layer with the component layer of the main circuit board, the ground plane layer is connected with the main ground layer of the main circuit board, the heat generated by the high-pressure line of the wiring layer is directly transmitted through the ground plane layer to the main ground layer on the main circuit board for heat dissipation, and the temperature rise can be effectively controlled.

Description

technical field [0001] The present invention relates to the technical field of mobile terminals, in particular to a mobile device. Background technique [0002] The FPC (abbreviation of Flexible Printed Circuit, also known as flexible circuit board) in the related art connects all the signals through the connection socket, and then directly inserts the connection socket on the motherboard, so that the FPC and the motherboard can only be connected through the connector. And rely on the pad to connect to the motherboard to form heat dissipation, the thermal resistance is large and the heat dissipation effect is poor. Contents of the invention [0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. Therefore, an object of the present invention is to provide a mobile device with good heat dissipation performance. [0004] The mobile device according to the embodiment of the present invention includes: a main...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/205
Inventor 范艳辉
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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