Modified benzoxazine resin and composition application thereof

A resin composition, benzoxazine technology, applied in electrical components, organic chemistry, printed circuits, etc., can solve the problems of low glass transition temperature, high glass transition temperature, unsatisfactory, etc., and achieve the effect of low dielectric loss

Inactive Publication Date: 2016-12-07
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the known existing benzoxazine compounds (for example: bisphenol A type benzoxazine, bisphenol F type benzoxazine) still have the following disadvantages: relatively low glass transition temperature ( Tg), relatively poor dielectric properties, unable to meet the needs of a new generation of high-performance lower dielectric, higher glass transition temperature

Method used

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  • Modified benzoxazine resin and composition application thereof
  • Modified benzoxazine resin and composition application thereof
  • Modified benzoxazine resin and composition application thereof

Examples

Experimental program
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manufacture example

[0070] Set up 3 liters of reaction vessels, which are equipped with reflux condensers, thermometers, and stirring devices. 134.0 grams (1mol) of terephthalaldehyde, 218 grams (2mol) of 4-aminophenol, 205.7 grams of propylene glycol monomethyl ether and 178.0 grams of Toluene was added for blending, stirred and heated, followed by reflux dehydration for 4 hours, and cooled to room temperature at about 115 to 125° C. to obtain a polyazomethine compound (Compound A). 388g of compound A was added to a 3-liter glass-jacketed reactor, followed by 172g of formaldehyde, 242ml of xylene and 484ml of butanol. The reaction mixture was heated to 80°C to 82°C with constant stirring to mix. Finally, 238 g of aniline was added, heated to 90 to 95° C., and refluxed for 6 hours. Add another 600ml xylene and 1200ml butanol in the final reaction mixture, so that the reaction temperature is reduced to normal temperature, the alcohol solvent is removed, and the modified benzoxazine compound product...

Embodiment

[0075] According to the formula listed in Table 1, the relevant components are fully mixed to obtain the resin varnish of the resin composition, wherein E1 to E8 represent the embodiments of the resin composition of the present invention, and C1 to C2 represent the comparative examples of the aforementioned resin composition. It should be noted that although the present invention distinguishes the composition into examples and comparative examples in order to demonstrate the efficacy of certain components or dosages, this distinction is only for convenience of description and does not mean that the comparative examples do not belong to a part of the present invention .

[0076] The names of chemicals used in the following examples and comparative examples are as follows:

[0077] LZ 8280: bisphenol F type benzoxazine resin (BPF-Bz), available from Huntsman;

[0078] LZ 8290: bisphenol A type benzoxazine resin (BPA-Bz), available from Huntsman;

[0079] LZ 8270: phenolphthale...

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PUM

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Abstract

The present invention provides a modified benzoxazine compound and a composition application comprising the same. The modified benzoxazine compound has a structure represented by formula (1) or (2), wherein R, R', A, B, m, n, a1, a2, a3 and b are defined as description. The invention also relates to a preparation method of the modified benzoxazine compound and products made from the composition.

Description

【Technical field】 [0001] The invention relates to a modified benzoxazine compound and a manufacturing method thereof, in particular to a modified benzoxazine compound applied to copper foil substrates and printed circuit boards. 【Background technique】 [0002] With the rapid development of electronic technology, the information processing of electronic products such as mobile communications, servers, and cloud storage continues to develop in the direction of "high-frequency signal transmission and high-speed digitalization". Therefore, low-dielectric resin materials have become the preferred choice for today's high-transmission rate substrates. The main development direction is to meet the requirements of high-speed information transmission and processing required by cloud technology and terminal servers. Therefore, the requirements for copper clad laminates (or laminates, copper foil substrates, copper clad laminate (CCL)) are mainly manifested in the need for materials wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/06C08L79/04C08L63/00C08L35/06C08L67/00C08L61/10C08K13/02C08K3/36C08K5/3445C07D265/12C07D265/16
CPCC08L35/06C07D265/12C07D265/16C08J2379/04C08G73/06C08J5/244C08F222/08H05K1/0373
Inventor 谢镇宇施惠婷
Owner ELITE MATERIAL
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