Electromagnetic radiation analyzing method for integrated circuits

Abstract

The invention belongs to the technical field of electromagnetic compatibility, in particular to an electromagnetic radiation analyzing method for integrated circuits. The method of the invention comprises the following steps: acquiring tangential magnetic field intensity and phase data Hms of m observation points on the first observation plane, the distance of which to the surface of an integrated circuit is h1 during a first working state of the integrated circuit; determining the number of equivalent electric dipoles in a time-domain equivalent electric dipole model as n; and according to the acquired tangential magnetic field intensity and phase data Hms of m observation points on the first observation plane, seeking the parameters of the n equivalent electric dipoles in the time-domain equivalent electric dipole model. The electromagnetic radiation analyzing method for integrated circuits proposed by the invention realizes the time-domain equivalent electric dipole model of the integrated circuit, which can be used for accurately analyzing and predicting the electromagnetic compatibility performance through the measured data and the model operation, thereby saving the measuring time and measuring cost and improving the analysis and prediction efficiency.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic compatibility, and in particular relates to a method for analyzing electromagnetic radiation of an integrated circuit. Background technique [0002] Integrated circuits include highly integrated active chips, passive lumped components, and integrated chips with different packaging structures. At the same time, the operating frequency in the integrated circuit increases, and the circuit structure becomes more complicated. The increase of circuit integration has aggravated the coupling phenomenon between equipment and boards, and the problems of signal distortion, crosstalk and electromagnetic radiation during circuit work have become more and more serious. [0003] On the other hand, high-density packaging is widely used in printed circuit board (Printed Circuit Board, hereinafter referred to as PCB) design, causing more electromagnetic interference problems between the PCB and the housing...

AI Technical Summary

Problems solved by technology

However, the accuracy and effect of the simulation software are not satisfactory

In many cases, the prediction of the electromagnetic compatibility characteristics of integrated circuits cannot even be completed

In addition, EMC simulation software requires accurate information such as the component composition, circuit design, wiring rules, and functions to be realized of the circuit board, and there is a risk of leaking confidential information in the circuit board.

Images