Double-sided flexible structural substrate for stretchable electronics
A structural and substrate technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of extendable electronic surfaces and low space occupancy, and achieve the effect of improving space utilization and high substrate surface occupancy
Inactive Publication Date: 2016-12-07
GUILIN UNIV OF ELECTRONIC TECH
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- Claims
- Application Information
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is the problem of low surface and space occupancy in existing stretchable electronics, and to provide a double-sided flexible structural substrate for stretchable electronics
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[0017] A double-sided flexible structural substrate for stretchable electronics, such as figure 1 and 2 As shown, it consists of film substrate 1, island 2 and groove 3. The thin film substrate 1, the island 2 and the trench 3 are the electrical functional basis for realizing stretchable and flexible electronic devices. The film substrate 1 supports the entire device structure. The island 2 supports the functional electronic components, and can realize stress isolation during the stretching process to protect the functional electronic components. The groove 3, that is, the part that is not the island 2, is the basis for achieving high ductility. When stretching, bending and / or twisting, the size of the island 2 itself changes very little, mainly relying on the high stretchability of the substrate between the grooves 3. Achieving flexibility and extensibility of the entire structure.
[0018] The main improvement of the present invention is that all the islands 2 are equall...
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The invention discloses a double-sided flexible structural substrate for stretchable electronics. The double-sided flexible structural substrate comprises a thin film substrate, islands and grooves, wherein each island is in a cylindrical shape, all islands are regularly arranged on an upper surface and a lower surface of the thin film substrate, the islands arranged on the upper surface of the thin film substrate and the islands arranged on the lower surface of the thin film substrate are in mirror symmetry with regard to the thin film substrate, the islands are separated by the grooves, functional devices are attached onto top surfaces of the islands, and connection wires are hidden in the grooves among the islands and are electrically connected with the functional devices. By the double-sided flexible structural substrate, the functional devices are attached onto the islands on the substrate and the islands under the substrate to achieve high substrate surface occupancy rate, thus, the space utilization of a stretchable flexible electronic device is improved to a great extent, and the requirements of a modern electronic product for part miniaturization and densification are met. The double-sided flexible structural substrate can be applied to a product having the substrate attached with functional devices on double surfaces and requiring high effective surface occupancy rate of the functional devices.
Description
technical field [0001] The invention relates to the technical field of extendable electronics, in particular to a double-sided flexible structural substrate for extendable electronics. Background technique [0002] Extensible electronics is a new type of electronic product, which overcomes the rigidity, brittleness, and fragility of traditional silicon-based electronic products, and cannot adapt to the application of more complex working planes. It is a representative product of advanced electronic manufacturing. In addition, stretchable electronic technology has attracted extensive attention in recent years due to its unique advantages of portability and applicability. However, most of the current stretchable electronic structures are single-sided structures, that is, only one side of the substrate is used to place functional devices and interconnect wires, which greatly limits the surface occupancy of the substrate structure, and does not meet the requirements of modern el...
Claims
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Login to View More IPC IPC(8): H01L23/12H01L23/13H01L23/14H01L23/52H01L23/48
CPCH01L23/12H01L23/13H01L23/14H01L23/145H01L23/48H01L23/481H01L23/52H01L24/49H01L2224/4905
Inventor 潘开林曹威武王文佳韩旭峰李婷婷王琳
Owner GUILIN UNIV OF ELECTRONIC TECH