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A kind of thermosetting resin composition and prepreg and laminate made by using the same
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A technology of resin composition and prepreg, applied in synthetic resin layered products, lamination, lamination devices, etc., can solve the problems of poor adhesion, low glass transition temperature, insufficient rigidity, etc.
Active Publication Date: 2018-08-07
SHENGYI TECH SUZHOU
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Problems solved by technology
A large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. However, there are still many problems to be solved in practical applications such as low transition temperature and poor adhesion.
For example, in the Chinese invention patent CN10544841B, a combination of hydrocarbon resin and allyl-modified phenolic resin is used to make printed circuit boards. Although the adhesive performance of the resin is improved, the peel strength of the board is improved, but it is still low. And the heat resistance of the system is low
Chinese patent CN104845363A uses hydrocarbon resin, allyl-modified benzoxazine resin and allyl-modified bismaleimide resin composition to make printed circuit boards, which improves heat resistance and peel strength , but because allyl-modified benzoxazine resin and allyl-modified bismaleimide resin will introduce a large number of hydroxyl groups, which will damage the dielectric properties of the system
Method used
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Synthetic example 1
[0057] Put N-(4-hydroxyphenyl)maleimide (190g, 1mol), phenol (94g, 1mol, M94) and oxalic acid (10g) into the flask equipped with thermometer, condenser and stirrer, mix and stir After uniformity, place in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (150mL, phenol / aldehyde ratio 1 / 0.8) to the flask over 0.5 hours; after adding formaldehyde, maintain 70°C The reaction product was dissolved and diluted with 400 mL of acetone at the temperature and stirring conditions for 15 hours; then, the reaction product was precipitated with a 40% methanol aqueous solution; the above dissolution-precipitation operation was repeated 3 to 5 times, and it was filtered, separated, Dry to obtain pure maleimide phenolic (P-1).
[0058] Take 100g of maleimide phenolic (P-1) prepared by the above method and 500g of methyl isobutyl ketone solvent and put them in a flask to fully mix and dissolve. The reaction system is depressurized and nitrogen is introduce...
Synthetic example 2
[0061] Referring to the method of actual synthesis example 1, the maleimide ester (B-2) with the following structure was prepared:
[0062] ; Among them, Ar is , R is phenyl;
[0063] Among them, n is 1-10, and the ratio of x to y is 0.5:1.
Synthetic example 3
[0065] Referring to the method of Synthesis Example 1, the maleimide ester (B-3) of the following structure was prepared:
[0066] ; Among them, Ar is: , R is maleimidophenyl;
[0067] Among them, n is 1-10, and the ratio of x to y is 0.1:1.
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Abstract
The invention discloses a thermosetting resin composition which is prepared from the following components based on the weight of solids: (a) 10 to 100 parts of hydrcarbon resin, (b) 20 to 100 parts of maleimide ester, and (c) 0.1 to 8 parts of an initiator. According to the thermosetting resin composition, the maleimide ester with a polyfunctional long chain structure and a rigid imide ring works together with the flexible hydrcarbon resin to form a thermosetting composition, and the maleimide ester and the rigid imide ring react with each other, so that finally the thermosetting resin composition and a prepreg made of the thermosetting resin composition as well as a laminated board have the characteristics of excellent dielectric property, heat resistance, adhesion property, flame retardancy, bending strength and toughness, high peeling strength, low water absorption rate, excellent processing property and the like.
Description
Technical field [0001] The invention relates to a thermosetting resin composition and a semi-cured sheet and laminated board produced by using the thermosetting resin composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of information processing and information transmission high-speed and high-frequency technology, higher and higher requirements have been placed on the dielectric properties of printed circuit board materials. To put it simply, the printed circuit board material needs to have a low dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, and interference between signals. Therefore, it is desirable to provide a thermosetting resin composition, a printed circuit board material made of this thermosetting resin composition can exhibit a sufficiently low low dielectric constant and low dielectric constant in...
Claims
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