Packaging substrate and manufacturing method therefor

Abstract

The invention discloses a packaging substrate and a manufacturing method therefor. An embodiment provides the packaging substrate, wherein packaging substrate comprises a supporting carrying board and a thin type substrate; the supporting carrying board comprises a carrier and a metal dielectric layer with a first surface and a second surface which are arranged oppositely; the first surface is in contact with the carrier; the thin type substrate comprises a first circuit layer, a first dielectric layer which is laminated on the first circuit layer and is in contact with the second surface of the metal dielectric layer, a second circuit layer which is formed in the other side, relative to the first circuit layer, of the first dielectric layer, and a first conductive through hole which is embedded in the first dielectric layer and equipped with opposite first end and second end; the first end is electrically connected with the first circuit layer while the second end is electrically connected with the second circuit layer; and the supporting carrying board is partially removed to form an opening to expose the first circuit layer while the non-removed part of the supporting carrying board is kept on the surrounding area of the thin type substrate. By adoption of the embodiment of the packaging substrate provided by the invention, the warping of the thin type substrate can be effectively prevented, and the quality of the packaging substrate is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging substrate and a method for manufacturing the packaging substrate. Background technique [0002] In the manufacturing process of semiconductor packaging substrates, since the packaging substrates are generally composed of materials with different coefficients of thermal expansion (hereinafter referred to as CTE) such as resins and metals, the metals, resins and other materials in the packaging substrates will be produced after the heating process. Different degrees of expansion result in unbalanced internal stress. When the thickness of the manufactured packaging substrate is less than 100 μm, it is easy to cause the packaging substrate to warp due to the above reasons, and the thinner the packaging substrate is, the more obvious the phenomenon of warping after the heating process is. [0003] Therefore, the existing packaging substrates of this type and the met...

AI Technical Summary

Problems solved by technology

When the thickness of the manufactured packaging substrate is less than 100 μm, it is easy to cause the packaging substrate to warp due to the above reasons, and the thinner the packaging substrate is, the more obvious the phenomenon of warping after the heating process is.

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