PCB board, manufacturing method of PCB board and mobile terminal
A technology of a PCB board and a manufacturing method, applied in the field of mobile terminals, can solve the problems of poor heat dissipation effect of detection lines, affecting the service life of detection lines, etc., and achieve the effects of improving heat dissipation effect, reducing maintenance cost, and reliable heat dissipation
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Embodiment 1
[0051] Such as figure 1 and 4 As shown, the PCB board 100 of this embodiment includes a board body 1 , detection traces 2 and a heat dissipation layer 3 . The heat dissipation layer 3 is a thermally conductive silicone grease layer.
[0052] Specifically, such as figure 1 and Figure 4 As shown, the detection wiring 2 is arranged on the board body 1, and the detection wiring 2 has exposed copper parts, and the heat dissipation layer 3 is laid on the exposed copper parts, and the surface of the exposed copper parts and the heat dissipation layer 3 are treated with gold plating. layer.
[0053] A heat dissipation graphite layer 6 is laid on the heat dissipation layer 3 . Thus, when there is a current flowing in the detection wire 2, the heat transmitted from the detection wire 2 to the heat dissipation layer 3 can be further transferred from the heat dissipation layer 3 to the heat dissipation graphite layer 6, thereby further realizing the detection of the heat dissipation...
Embodiment 2
[0056] Such as figure 1 and image 3 As shown, the PCB board 100 of this embodiment includes a board body 1 , detection traces 2 and a heat dissipation layer 3 . The heat dissipation layer 3 is a thermally conductive silicone grease layer.
[0057] Specifically, such as figure 1 and image 3 As shown, the detection wiring 2 is arranged on the board body 1, and the detection wiring 2 has exposed copper parts, and the heat dissipation layer 3 is laid on the exposed copper parts, and the surface of the exposed copper parts and the heat dissipation layer 3 are treated with gold plating. layer.
[0058] A metal block 4 is arranged on the plate body 1 , and the heat dissipation layer 3 is in contact with the metal block 4 . Therefore, when there is a current flowing in the detection wire 2, the heat transferred from the detection wire 2 to the heat dissipation layer 3 can be further transferred from the heat dissipation layer 3 to the metal block 4, thereby further realizing th...
Embodiment 3
[0060] Such as figure 1 and figure 2 As shown, the PCB board 100 of this embodiment includes a board body 1 , detection traces 2 and a heat dissipation layer 3 . The heat dissipation layer 3 is a thermally conductive silicone grease layer.
[0061] Specifically, such as figure 2 As shown, the detection wiring 2 is arranged on the board body 1, and the detection wiring 2 has exposed copper parts, and the heat dissipation layer 3 is laid on the exposed copper parts, and the surface of the exposed copper parts and the heat dissipation layer 3 are treated with gold plating. layer.
[0062] Such as figure 2 As shown, the board body 1 is provided with a shielding cover 5, and the shielding cover 5 is in contact with the heat dissipation layer 3. Therefore, during the use of the detection line 2, the heat transmitted from the detection line 2 to the heat dissipation layer 3 can be further determined by The heat dissipation layer 3 is transferred to the shielding cover 5 , so ...
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