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A solder screening device

A screening device and solder technology, which is applied in the fields of filtering, solid separation, chemical instruments and methods, etc., can solve the problems of welding slag fragmentation, affecting welding quality, forming bubbles or welding bumps on the surface of parts, etc., so as to ensure the firmness of the connection Effect

Active Publication Date: 2019-12-31
安徽鼎恒再制造产业技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing screening method is carried out by vibrating motor, and the screen is in a flat state. Using this screen to screen solder and welding slag can easily cause the welding slag to break under excessive vibration and mix with the solder, affecting the purity of the solder. When used again, it is easy to form bubbles or welding spots on the surface of the parts during submerged arc welding, which seriously affects the welding quality

Method used

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  • A solder screening device
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Embodiment Construction

[0013] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below.

[0014] Such as figure 1 , figure 2 As shown, a solder screening device includes a solder frame 1 and a solder slag frame 2, the solder frame 1 is located directly below the solder slag frame 2, and a ring spring 3 is fixed on the inner wall of the solder frame 1, and the inner wall of the spring 3 Both ends are fixed on the frame body of the welding slag frame 2, the bottom surface of the welding slag frame 1 is a slope with low left and high right, the lower part of the left end surface of the solder frame 1 is provided with a chemical outlet 4, and the bottom surface of the welding slag frame 2 It is a slope with high left and low right. The bottom surface of the welding slag frame 2 is made of screen mesh. The lower part of the right end surface of the welding slag frame 2 is provi...

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PUM

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Abstract

The invention relates to a solder screening device, comprising a solder frame and a solder slag frame, the solder frame is located directly below the solder slag frame, a ring spring is fixed on the inner wall of the solder frame, and the inner ends of the springs are all fixed on the solder slag frame On the frame body, the bottom surface of the solder frame is a slope with low left and high right, the lower part of the left end face of the solder frame is provided with a chemical outlet, the bottom surface of the solder slag frame is a slope with high left and low right, and the bottom of the solder frame is a slope with high left and low right. The bottom surface is made of screen mesh, and the lower part of the right end surface of the welding slag frame is provided with a slag outlet, which is located above the chemical outlet and extends to the outside of the solder frame; the left end surface of the welding slag frame is equipped with a vibration motor. Under the vibration of the vibrating motor, the mixture of solder and welding slag is separated on the screen. Since the screen is tilted, the welding slag and solder can be separated quickly to prevent the welding slag from being shattered and mixed into the solder; the welding slag frame is placed entirely on the solder In the frame, under the connection effect of the support column, the connection firmness of the welding slag frame is ensured, and the degree of freedom of the welding slag frame is not affected.

Description

technical field [0001] The invention relates to the technical field of solder screening equipment, in particular to a solder screening device. Background technique [0002] In the process of submerged arc welding, the solder is continuously fed along with the welding wire, and falls to the surface of the part with the welding wire. Some solder is integrated with the molten metal welding liquid to form welding slag, and some solder falls directly without use to form waste. These scraps still have use value after re-screening, so this part of the solder needs to be processed. [0003] The existing screening method is carried out by vibrating motor, and the screen is in a flat state. Using this screen to screen solder and welding slag can easily cause the welding slag to break under excessive vibration and mix with the solder, affecting the purity of the solder. When it is used again, it is easy to form bubbles or welding spots on the surface of the parts during the submerged ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B07B1/28B07B1/46
CPCB07B1/28B07B1/46
Inventor 程敬卿周乾坤
Owner 安徽鼎恒再制造产业技术研究院有限公司
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