Grinding and thinning device of wafers

A technology of wafer and worktable, applied in grinding machine, grinding frame, grinding bed and other directions, can solve the problems of affecting the quality of the wafer and the thickness of the lens, and achieve high safety performance, low work intensity and high work efficiency Effect

Inactive Publication Date: 2016-12-21
合肥钰芹信息科技有限公司
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Problems solved by technology

[0002] Wafer is an important component in LED lamps, but Genie has extremely strict requirements in the production process, such as model size, thickness, etc., especially in terms of thickness, but the wafer thinning technology in the prior art is all Production and processing are carried out with mechanical equipment. However, in the production process, the thickness of the lens may vary due to the difference in the raw material of the wafer, which will affect the quality of the wafer.

Method used

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  • Grinding and thinning device of wafers

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Embodiment approach

[0013] In order to achieve the required technical effect of the present invention, the present invention selects the following embodiments: a wafer grinding and thinning device, including a workbench, the workbench is provided with a fixing seat, and the fixing seat is provided with a fixing slot. The workbench is provided with a moving slot, the moving slot is provided with a moving bracket, the moving bracket is provided with a rotating shaft, the moving bracket is provided with a mechanical arm, one end of the mechanical arm is connected to the rotating shaft, and the other end of the mechanical arm is A motor is provided, and the motor is provided with a grinding wheel shaft, and the grinding wheel shaft is connected with a grinding wheel.

[0014] Preferably, the setting is at the central position of the workbench.

[0015] Preferably, there are protrusions on both sides of the upper surface of the workbench, the protrusions are provided with grooves, and the grooves, the...

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Abstract

The invention belongs to the field of producing and processing of wafers, and particularly relates to a grinding and thinning device of the wafers. According to the technical scheme, the grinding and thinning device comprises a work table, the work table is provided with a fixed base, the fixed base is provided with a fixed clamping groove, the work table is provided with a moving groove, the moving groove is provided with a moving support, the moving support is provided with a rotating shaft and a mechanical arm, one end of the mechanical arm is connected to the rotating shaft, a motor is arranged at the other end of the mechanical arm and is provided with a grinding wheel shaft, and the grinding wheel shaft is connected to a grinding wheel. The grinding and thinning device has the advantages that operation and use are simple, the working intensity is small, the work efficiency is high, the safety performance is high in the use process, and cleaning after use is convenient.

Description

technical field [0001] The invention belongs to the field of wafer production and processing, in particular to a wafer grinding and thinning device. Background technique [0002] Wafer is an important component in LED lamps, but Genie has extremely strict requirements in the production process, such as model size, thickness, etc., especially in terms of thickness, but the wafer thinning technology in the prior art is all Production and processing are carried out with mechanical equipment, but the thickness of the lens may vary due to the difference in the raw material of the wafer during the production process, thus affecting the quality of the wafer. Contents of the invention [0003] The invention is a wafer grinding and thinning device which can grind and adjust the thickness of the wafer through manual operation, and reduce the economic loss caused by the disc thickness discrepancy. [0004] In order to achieve the required technical effect of the present invention, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B13/00B24B13/005B24B41/02
CPCB24B13/00B24B13/005B24B41/02
Inventor 赵少芹
Owner 合肥钰芹信息科技有限公司
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