usb socket and its forming method

Abstract

The invention provides a USB socket and a forming method thereof. The USB socket comprises an outer shell, a mounting base and terminals, wherein the terminals are formed in the mounting base, the mounting base is formed in the outer shell, the outer surface of the outer shell is a rough surface subjected to rough surface treatment, and the outer surface of the outer cover is covered with an injection molded layer obtained through injection molding treatment. Since the rough surface of the outer shell effectively enhances a binding force between the outer shell and the injection molded layer, the injection molded layer can be kept on the surface of the outer shell steadily, thereby effectively improving waterproof performance of the injection molded layer for the USB socket, and improving integral waterproof performance of the USB socket; meanwhile, since the binding force between the outer shell and the injection molded layer is effectively enhanced by means of the rough surface of the outer shell, the binding strength requirement can be satisfied by spraying the thin injection molded layer on the outer surface of the outer shell, thereby effectively reducing thickness of the USB socket, and being conducive to realizing miniaturization of the USB socket.

Description

technical field [0001] The invention relates to the technical field of data transmission equipment, in particular to a USB socket and a forming method thereof. Background technique [0002] Micro USB2.0 (Micro Universal Serial Bus, tiny universal serial bus interface 2.0) socket is mainly composed of iron shell, iron shell bracket, plastic, and terminals. The terminals are embedded into the plastic and then assembled to the iron shell. Finally, the iron shell bracket is fixed on the iron shell by laser. There is an assembly gap between the iron shell and the plastic parts. When liquid enters the USB port, the liquid can easily enter the solder pin position of the USB socket from the gap between the iron shell and the plastic parts. [0003] In order to solve the above problems, in the prior art, a plastic layer for wrapping the iron shell is generally injected around the iron shell. However, since the bonding force between the plastic layer and the iron shell is poor, the ...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a USB socket to solve the problem in the background art that the plastic layer is not waterproof to the USB socket due to the poor bonding force between the plastic layer and the iron shell, and the iron shell and the plastic layer are easily separated. poor problem

Images