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Pad for fixing FPC soft board and FPC welding process

A technology for soft boards and backing boards, which is applied in the field of FPC solder mask technology and backing boards, and can solve problems such as swelling and bending of FPC soft boards

Inactive Publication Date: 2016-12-21
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a backing plate for fixing the FPC soft board, which aims to solve the problem of bulging and bending of the FPC soft board in the FPC solder mask process

Method used

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  • Pad for fixing FPC soft board and FPC welding process
  • Pad for fixing FPC soft board and FPC welding process
  • Pad for fixing FPC soft board and FPC welding process

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] It should also be noted that the orientation terms such as left, right, up and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should not be regarded as re...

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Abstract

The present invention provides a pad for fixing an FPC soft board. In FPC welding process, the pad is used for the laminated fixation of the FPC soft board. The pad comprises a body which is provided with a plurality of through holes through which solder resist ink separated from the FPC soft board falls at an area for the laminated fixation of the FPC soft board. By using the pad, the conditions of FPC soft board protrusion and bending in an FPC welding process development step can be reduced, and the drop of the solder resist ink is reduced.

Description

technical field [0001] The invention belongs to the field of FPC soft board preparation, and in particular relates to a backing plate for fixing an FPC soft board in an FPC solder resist process and an FPC solder resist process. Background technique [0002] In the preparation of FPC (Flexible Printed Circuit, flexible circuit board), in order to protect the circuit from the influence of the external environment, most circuit board factories adopt the method of laminating cover film or printing ink to protect the circuit. However, due to the high cost of the cover film itself and the high requirements for processing equipment, and the thickness of the cover film is much larger than the thickness of the solder mask, it directly affects its bendability. Therefore, many FPC soft boards are protected by printing solder resist ink through solder resist process. [0003] In the FPC solder mask process, printing, pre-baking, development and post-baking need to be carried out in se...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/0165
Inventor 黄明起覃红秀何淼
Owner SHENZHEN SUNTAK MULTILAYER PCB