LED packaging base material, packaging method and LED packaged device

Abstract

The invention relates to an LED packaging base material, comprising a first pole area and a second pole area that are isolated through a hollowed-out area; the inner side of a support base area is connected respectively with the outer sides of the first pole area and second pole area through a first pre-stamped area and a second pre-stamped area; the invention also provides a packaging method and LED packaged device based on the packaging base material, a chip is bonded to the first pole area through die bond, a pad on the chip is connected with the second pole area through a wire, and the first pole area, the second pole area, the chip, the hollowed-out area and the wire are packaged with packaging glue; the first pre-stamped area and the second pre-stamped area are stamped, and the packaged first pole area, second pole area, chip, hollowed-out area, wire and packaging glue are separated from the support base area. Compared with the prior art, the LED packaging base material, the packaging method and the LED packaged device have no need for a manufacturing process of a support, the process is short, the first pole area and the second pole area are connected through the packaging glue, the packaging glue on an insulating area and the first and second pole areas is integrally formed, and a packaged product has high structural stability.

Description

technical field [0001] The invention relates to the technical fields of LED lighting, induction, monitoring and automotive electronics, in particular to a base material for LED packaging, a packaging method and an LED packaging device. Background technique [0002] LED packaging is developing toward the application trend of large-scale production, lower cost, simplified process, flexible design, smaller size, thinner, and higher integration. [0003] With the development of LED chip epitaxy technology and terminal application technology, the industry has put forward new and higher requirements for the optics, heat, electricity, and mechanical structure of LED packaging. [0004] In the prior art, the support is first molded on the copper sheet with a thermoplastic material, and then the LED is packaged. The process flow is relatively long and the product structure stability is poor. Contents of the invention [0005] In order to solve the above problems, the present inven...

AI Technical Summary

Problems solved by technology

[0004] In the existing technology, the bracket is first sealed with thermoplastic material on the copper sheet, and then the LED is packaged. The process is relatively long and the stability of the product structure is poor.

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