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Array substrate and preparation method thereof and display panel

A technology of array substrates and substrate substrates, which is applied in the manufacture of semiconductor/solid-state devices, the use of electromagnetic means, instruments, etc., can solve the problems of increasing the overall thickness of the display panel, and achieve the effect of solving the overall thickness increase and realizing temperature sensing

Inactive Publication Date: 2017-01-11
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing temperature detection method, in order to avoid damage to the temperature detection chip, the top of the temperature detection chip often needs to be covered with a protective layer, which will increase the overall thickness of the display panel; in addition, considering the size factor of the temperature detection chip , in order not to affect the normal display of the display panel, the temperature detection chip can only be installed in the non-display area located at the edge of the display panel, that is, only the non-display area on the liquid crystal display panel has the temperature detection function, so it has certain limitations

Method used

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  • Array substrate and preparation method thereof and display panel
  • Array substrate and preparation method thereof and display panel
  • Array substrate and preparation method thereof and display panel

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Experimental program
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Embodiment 1

[0058] figure 1 A schematic structural diagram of an array substrate provided in Embodiment 1 of the present invention, as shown in figure 1 As shown, the array substrate includes: a base substrate 8 and a number of driving signal lines 1, a number of signal detection lines 3 and a number of temperature sensing modules 2 arranged on the base substrate 8, wherein the temperature sensing module 2 It is connected with the corresponding driving signal line 1 and signal detection line 3, the driving signal line 1 is used to output the driving signal to the temperature sensing module 2 to drive the temperature sensing module 2 to work, and the temperature sensing module 2 is used to sense the temperature , and output a corresponding current signal, and the signal detection line 3 is used to read the current signal output by the temperature sensing module 2 .

[0059] It should be noted that in the drawings, the drive signal line 1 extends horizontally, and the signal detection line...

Embodiment 2

[0072] image 3 It is a schematic structural diagram of an array substrate provided in Embodiment 2 of the present invention, Figure 4 for image 3 A cross-sectional schematic diagram of a pixel unit provided with a sensing thin film transistor and a temperature-sensitive resistor, as shown in image 3 and Figure 4 As shown, different from the first embodiment above, the temperature sensing module 2 in this embodiment not only includes the sensing thin film transistor T1, but also includes a temperature sensitive resistor St connected in series with the sensing thin film transistor T1.

[0073] Specifically, the first gate 9a of the sensing thin film transistor T1 is connected to the corresponding drive signal line 1, the first source 12a of the sensing thin film transistor T1 is connected to the first end of the temperature-sensitive resistor St, and the sensing thin film transistor T1 The first drain 13a of the sensor is connected to the corresponding signal detection l...

Embodiment 3

[0081] Figure 5 A schematic structural diagram of an array substrate provided in Embodiment 3 of the present invention, as shown in Figure 5 As shown, different from the array substrates in the first and second embodiments above, the driving signal line 1 and the gate line 4 in this embodiment are the same signal wiring.

[0082] Compared with the technical solutions of the first and second embodiments above, the technical solution provided by this embodiment can effectively reduce the number of signal traces on the array substrate, thereby helping to improve the aperture ratio.

[0083] In this embodiment, when the gate driving unit loads the driving signal to the gate line 4 (driving signal line 1) row by row, the display thin film transistor T2 and the temperature sensing module 2 (sensing thin film transistor T1) of the corresponding row are simultaneously activated. driving, the data signal in the data line 6 is written into the corresponding pixel electrode through th...

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Abstract

The invention discloses an array substrate and a preparation method thereof and a display panel. The array substrate comprises a substrate, and a plurality of drive signal lines, a plurality of signal detection lines and a plurality of temperature sensing modules which are arranged on the substrate; the temperature sensing modules are connected with the corresponding drive signal lines and signal detection lines; the drive signal lines are used for outputting drive signals to the corresponding temperature sensing modules to drive the temperature sensing modules to work; the temperature sensing modules are used for sensing temperatures and outputting corresponding current signals; and the signal detection lines are used for reading the current signals output by the temperature sensing modules. According to the array substrate and the preparation method thereof and the display panel, the drive signal lines, the signal detection lines and the temperature sensing modules for temperature sensing are integrated in the array substrate, so that increase of the overall thickness of the display panel can be effectively avoided. Furthermore, the positions of the temperature sensing modules on the array substrate are not limited, and the temperatures of various regions on the array substrate can be sensed.

Description

technical field [0001] The present invention relates to the field of touch technology, in particular to an array substrate, a preparation method thereof, and a display panel. Background technique [0002] In the prior art, in order to realize the temperature detection function, generally a plurality of temperature detection chips are arranged on the outside of the box substrate in the display panel, and the temperature detection is performed through the temperature detection chips. [0003] However, in the existing temperature detection method, in order to avoid damage to the temperature detection chip, the top of the temperature detection chip often needs to be covered with a protective layer, which will increase the overall thickness of the display panel; in addition, considering the size factor of the temperature detection chip , in order not to affect the normal display of the display panel, the temperature detection chip can only be arranged in the non-display area loca...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L21/77G01K7/16
CPCG01K7/16H01L27/1214H01L27/1259
Inventor 韩艳玲董学吕敬王海生吴俊纬丁小梁王鹏鹏刘伟
Owner BOE TECH GRP CO LTD