Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inkjet printing metal pattern and preparation method thereof

A metal pattern and inkjet printing technology, which is applied in the preparation of inkjet printed metal patterns and the field of inkjet printed metal patterns, can solve the problems of high resistivity and low conductivity of metal patterns, and achieve improved conductivity and high conductivity , the effect of low resistivity

Active Publication Date: 2018-08-10
GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for preparing inkjet printed metal patterns, aiming to solve the problem that the resistivity of inkjet printed metal patterns is very high and the conductivity is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inkjet printing metal pattern and preparation method thereof
  • Inkjet printing metal pattern and preparation method thereof
  • Inkjet printing metal pattern and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0015] The aspect ratio is defined as the ratio of the largest diameter to the smallest diameter of a metal particle. The solid content of the liquid is defined as the weight ratio of the solid content in the liquid to the total weight of the liquid.

[0016] see figure 1 , figure 2 and image 3 , a method for preparing an inkjet printed metal pattern provided by an embodiment of the present invention, comprising the following steps:

[0017] S1) Make barrier layer lines: use the first ink x to print on the substrate 10 through the first inkjet printing S11, and form the first pattern lines 25...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
boiling pointaaaaaaaaaa
surface tensionaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention belongs to the field of printing electronic device, and provides a preparation method of ink jet printing metal patterns, and the ink jet printing metal patterns obtained via application of the preparation method. The preparation method comprises following steps: a first ink is subjected to primary ink jet printing, strengthened coffee-ring effect treatment, and drying curing so as to obtain blocking layer lines; a second ink is subjected to secondary ink jet printing in grooves of the blocking layer lines, and is subjected to Marangoni effect treatment and crystal growth so as to obtain filled layer lines and obtain the metal patterns. According to the preparation method, in preparation of the groove-shaped blocking layer lines, the filled layer lines are prepared in the blocking layer lines, so that the thickness of the metal patterns is ensured to be uniform; in forming of the second pattern lines under Marangoni effect, the morphology of the second pattern lines is maintained via the blocking layer lines, and rapid sintering is not necessary, so that it is convenient for growth of conductive material crystals and crystal nucleus, and the obtain metal patterns are low in electrical resistivity, and high in electric conductivity.

Description

technical field [0001] The invention belongs to the field of printed electronic devices, and in particular relates to a method for preparing an inkjet printed metal pattern and an inkjet printed metal pattern obtained by using the method. Background technique [0002] Inkjet printed metal patterns have attracted more and more attention from manufacturers because of their large area, flexibility and low cost, which are not available in silicon-based microelectronics products. Existing inkjet printing of metal patterns generally produces pattern lines on a substrate by means of conventional continuous ink jet (CIJ for short) or drop on demand (DOD for short), and is then processed to form a metal pattern. However, the inkjet printing of metal patterns in the prior art generally has the problem that the resistivity of the metal pattern is very high and the electrical conductivity is low. For example: [0003] In the prior art, in the first inkjet printing technology for makin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B41M5/00
Inventor 李耘付东
Owner GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com