A chip punching mechanism of a multi-chip smart card chip packaging device

A smart card chip and packaging device technology, which is applied to electrical components, stone processing tools, electric solid devices, etc., can solve the problems of affecting chip packaging accuracy, affecting packaging speed, and slow packaging speed, so as to save packaging time and improve packaging speed and efficiency, the effect of improving packaging speed

Active Publication Date: 2018-08-03
GUANGZHOU MINGSEN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Only two chips can be punched out at a time, which affects the packaging speed
[0005] 2. After the packaging of the first group of chips is completed, it is necessary to rotate the card 180° or rotate the chip 180° to ensure that the second group of chips can be accurately packaged into the packaging slot of the card. On the one hand, the package The speed is slow and the production efficiency is low. On the other hand, it is easy to affect the packaging accuracy of the chip

Method used

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  • A chip punching mechanism of a multi-chip smart card chip packaging device
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  • A chip punching mechanism of a multi-chip smart card chip packaging device

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Embodiment Construction

[0026] The present invention will be further described in detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0027] see figure 2 The chip punching mechanism 4 of the multi-chip smart card chip packaging device of the present invention is two arranged side by side, and each chip punching mechanism 4 includes a punching die 4-2 and a punching die set below the punching die 4-2. As for the actuator, two punching holes 4-21 are arranged in each punching die 4-2; two chip strips (not shown) respectively pass under the two punching dies 4-2, and the chips in the two chip straps The orientations differ by 180°.

[0028] see Figure 2-Figure 8 , in each chip punching mechanism 4, the punching executive mechanism includes a punching bracket 4-1, a punching rod 4-10 for punching the chip out of the chip belt, and a fixed punching rod 4 -10 punching rod holder 4-8 and the punching dri...

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PUM

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Abstract

The invention discloses a chip blanking mechanism of a multi-chip intelligent card chip packaging device. Two chip blanking mechanism bodies are arranged side by side. Each chip blanking mechanism body comprises a blanking die and a blanking execution mechanism arranged below the blanking die. Two blanking holes are formed in each blanking die. Two chip belts pass through the lower portions of the two blanking dies correspondingly, and the difference between the directions of chips in the two chip belts is 180 degrees. The multi-chip intelligent card chip packaging device with the chip blanking mechanism has the beneficial effects of being high in packaging speed, production efficiency and packaging precision and the like.

Description

technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a chip blanking mechanism of a smart card chip packaging device. Background technique [0002] In the smart card production process, it is necessary to package chips into the card. A common smart card is provided with one chip in each card, and in addition, some cards are provided with multiple chips, for example, four chips. see figure 1 , in the multi-chip smart card 1, some of the chips are arranged near one end of the card, and these chips have the same orientation, called the first group of chips 1-1, and the rest of the chips are arranged near the other end of the card, and the orientation of these chips is also the same , called the second group of chips 1-2; the orientations of the two groups of chips in the card differ by 180°. The chip before packaging is punched out from the chip tape by the chip punching mechanism, and two chips are punched out each time. The o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B28D1/00
CPCB28D1/00H01L21/67092H01L2221/67
Inventor 王开来房训军李南彪赖汉进席道友
Owner GUANGZHOU MINGSEN TECH CO LTD
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