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A symmetrical laminated high-strength copper-clad laminate and its preparation method

A high-strength, copper-clad laminate technology, applied in chemical instruments and methods, other household appliances, electronic equipment, etc., can solve problems such as damaged equipment, reduced equipment service life, and production environment damage

Active Publication Date: 2018-06-01
江门市龙兴电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is light, it will cause more overflow and cause waste, which will cause a large deviation in product thickness. If it is serious, it will pollute the production equipment and destroy the production environment. What is more, it will damage the equipment, which not only affects the technical quality of the product, It also reduces the service life of the equipment

Method used

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  • A symmetrical laminated high-strength copper-clad laminate and its preparation method
  • A symmetrical laminated high-strength copper-clad laminate and its preparation method
  • A symmetrical laminated high-strength copper-clad laminate and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] The embodiment of the present invention provides a method for preparing a symmetrically stacked high-strength copper clad laminate, which includes the following steps:

[0073] Choose copper foil and the first prepreg, second prepreg, third prepreg, and fourth prepreg as shown in Table 1;

[0074] Table 1 Reinforcing materials and glue content of each prepreg

[0075]

[0076] Laminate one copper foil, one first prepreg, one second prepreg, one third prepreg, four fourth prepregs, one third prepreg, one second prepreg, and one first prepreg in sequence, Then, they were put into a vacuum hot press for hot pressing to obtain copper clad laminate one respectively. The parameter settings of the vacuum hot press are shown in Table 2.

[0077] Table 2 Hot press molding parameter setting table

[0078] Hot press molding parameters

Embodiment 2

[0080] The embodiment of the present invention provides a method for preparing a symmetrically stacked high-strength copper clad laminate, which includes the following steps:

[0081] Choose copper foil and the first prepreg, second prepreg, third prepreg, and fourth prepreg as shown in Table 3;

[0082] Table 3 Reinforcing materials and glue content of each prepreg

[0083]

[0084] Laminate one copper foil, one first prepreg, one second prepreg, one first prepreg, four fourth prepregs, one first prepreg, one second prepreg, and one first prepreg in turn , And then put it into a vacuum hot press for hot pressing to obtain two copper clad laminates respectively. The parameter settings of the vacuum hot press are shown in Table 4.

[0085] Table 4 Hot press forming parameter setting table

[0086]

[0087]

Embodiment 3

[0089] The embodiment of the present invention provides a method for preparing a symmetrically stacked high-strength copper clad laminate, which includes the following steps:

[0090] Choose copper foil and the first prepreg, second prepreg, third prepreg, and fourth prepreg as shown in Table 3;

[0091] Table 5 Reinforcing materials and glue content of each prepreg

[0092]

[0093] Laminate one copper foil, one third prepreg, one second prepreg, one third prepreg, four fourth prepregs, one third prepreg, one second prepreg, and one third prepreg in turn , And then put it into a vacuum hot press for hot pressing to obtain three copper clad laminates. The parameter settings of the vacuum hot press are shown in Table 4.

[0094] Table 6 Hot press forming parameter setting table

[0095]

[0096]

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Abstract

The invention provides a high-strength copper clad plate of a symmetrically stacked structure and a preparation method thereof. Through the prepreg symmetrically stacked structure of a reinforcing material with different thicknesses, a thin sheet is placed in a middle in a stacking manner, but a thick sheet is stacked at an outer layer; in the condition of guaranteeing the quality of a copper clad plate, edge resin can be prevented from flowing out during heat pressing, a corner thickness is prevented from exceeding a tolerance range, and the thickness control ability of the copper clad plate is greatly increased; on the other hand, the strength of the copper clad plate obtained after hot press molding is far higher than that of an ordinary copper clad plate, moreover, the external surface of the obtained copper clad plate is quite smooth and flat, and the application requirement of the copper clap plate is met; what is noteworthy is that the high-strength copper clad plate of the symmetrically stacked structure and the preparation method thereof are applicable to various resin formulas and are high in universality, moreover, the preparation method is simple to operate, the quality risk is low, and the production can be continued; the efficiency is high, and the production benefit of an enterprise can be greatly improved.

Description

Technical field [0001] The invention belongs to the technical field of copper-clad laminate production methods, and specifically relates to a symmetrically stacked high-strength copper-clad laminate and a preparation method thereof. Background technique [0002] Copper Clad Laminate (Copper Clad Laminate, full name Copper Clad Laminate, CCL in English), is a kind of glass fiber cloth as a reinforcing material, impregnated with resin, one or both sides covered with copper foil, and then formed by hot pressing product. Copper clad laminate is the basic material of the electronics industry, mainly used for processing and manufacturing printed circuit boards (PCB). [0003] With the development of "light", "small", "thin" and "fast" in terminal electronic products, circuit boards are constantly developing in the direction of line density and interlayer thinning. Therefore, the impedance characteristics of the transmission circuit and the Reliability, component assembly and processing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/02B32B17/12B32B17/06B32B17/04B32B15/20B32B37/06B32B37/10
CPCB32B5/26B32B15/14B32B15/20B32B37/06B32B37/1018B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2307/54B32B2307/734B32B2457/08
Inventor 曾金师李金梅黎忠良何庭玉
Owner 江门市龙兴电子材料有限公司
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