Embedded water-cooled heat sink

Abstract

The invention discloses an embedded water-cooled heat sink. The embedded water-cooled heat sink comprises a base platform and a copper pipe, wherein the base platform is made of aluminum and is in a flat cuboid shape, an installation hole position is arranged on a front surface of the base platform, the copper pipe comprises a plurality of vertical pipes independent to one another and two horizontal pipes, two ends of each vertical pipe are respectively welded and fixed on side walls of the two horizontal pipes, the interiors of the vertical pipes communicate with the interiors of the horizontal pipes, a water inlet pipe and a water outlet pipe are arranged on each of the two horizontal pipes, a groove is formed in the front surface or a back surface of the base platform and is the same as the shape of the copper pipe, the copper pipe is embedded into the groove, the depth of the groove is not smaller than the thickness of the copper pipe, a heat conduction adhesive is filled between the copper pipe and the groove, and the copper pipe is fixed on the base platform by the heat conduction adhesive. The embedded water-cooled heat sink is simple in structure, is convenient to fabricate and has a good and uniform heat conduction effect, the circulation path of cooling water in the base platform is reduced, and the heat dissipation efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of radiators, in particular to an embedded water-cooled radiator. Background technique [0002] At present, the core components of valve groups used in high-power power electronic devices are silicon strings composed of high-power semiconductor devices and water-cooled radiators. In order to ensure the normal operation of the valve group, it is necessary to install various forms of radiators, such as profile radiators, heat pipe radiators and water-cooled radiators, etc., whose function is to quickly take away the heat generated by semiconductor devices. Among the existing water-cooled radiators, there is a copper tube embedded in the installation surface of the abutment, which can achieve a very good heat dissipation effect. As a result, the heat dissipation on the abutment is uneven, the cooling water travels a long distance, and the cooling water temperature in the second half is high, which cannot achieve a good ...

AI Technical Summary

Problems solved by technology

Among the existing water-cooled radiators, there is a copper tube embedded in the installation surface of the abutment, which can achieve a very good heat dissipation effect. The heat dissipation on the abutment is uneven, the cooling water travels a long distance, and the cooling water temperature in the second half is high, which cannot achieve a good cooling effect, and even causes the water temperature at the rear end to be too high to affect the heat dissipation of the semiconductor element.

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