Welding method of element pins

Abstract

The invention relates to a welding method of element pins. The welding method is used for welding pins of an element to a circuit board. The welding method of element pins comprises the following steps that first, the element is placed at the to-be-welded position of the circuit board, and solder paste bars are drawn on all the pins in the direction perpendicular to the arraying direction of the pins of the element through a spray gun; second, the circuit board and the element are placed in an oven to be baked, and the temperature of the oven is lower than the fusion temperature of the lowest fusion point part in the element and the circuit board; and third, the circuit board and the element are taken out from the oven, hot airflow is supplied through a hot air gun, the hot airflow is blown to the pins, and the solder paste bars are fused so as to weld the pins to the circuit board. According to the welding method of the element pins, one the one hand, operation and implementation are easy; and on the other hand, the parts, not resistant to high temperatures, in the element and the circuit board are subjected to high-temperature treatment, so that parts with low cost can be used in the elements and the circuit board, the welding effect is good, and the quality of products is guaranteed.

Description

technical field [0001] The present invention relates to a method for soldering the pins of components to a circuit board. Background technique [0002] In the manufacturing process of the circuit board, the following two methods are usually used to solder the pins of the components to the circuit board: one is to directly solder the pins to the circuit board; the other is to draw solder paste on the pins. The components and circuit boards are baked in a high-temperature oven to melt the solder paste, and then the solder paste is solidified to achieve soldering. The disadvantage of the first method is that when the number of pins is large and the pin density is large, it is difficult to weld one by one, and it is difficult for personnel to operate, thus affecting the welding effect. The disadvantage of the second method is that the baking temperature in the oven is relatively high, usually reaching three or four hundred degrees Celsius, which makes the parts or circuit board...

AI Technical Summary

Problems solved by technology

The disadvantage of the first method is that when the number of pins is large and the pin density is high, it is difficult to weld one by one, and it is difficult for personnel to operate, thus affecting the welding effect

The defect of the second method is that the baking temperature in the oven is relatively high, usually up to 300 or 400 degrees Celsius, which will cause abnormalities in the parts that are not resistant to high temperatures in the components or circuit boards and affect the product quality. If the parts that are not resistant to high temperatures are replaced The use of high temperature resistant materials will greatly increase the cost of the product