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Gluing method, structure and parts of micro-perforated panel and honeycomb sandwich structure

A honeycomb interlayer and micro-perforation technology, applied in the field of noise reduction and noise reduction, can solve the problems of no obvious effect of noise reduction and noise reduction, reduced noise reduction effect of parts, lack of noise reduction, etc., to achieve good noise reduction and noise reduction effect, and improve the effect of noise reduction.

Inactive Publication Date: 2017-02-15
深圳市同海高科技实验室有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) This technology is suitable for products with large panel apertures, but this process is not suitable for bonding of orifice plates with small apertures (diameter ≤ 1mm)
[0007] (2) Due to the defects of the molding process, the perforated panel is prone to clogging during the bonding process. Since the functional effect of noise reduction of the structural parts is greatly reduced after the clogged hole, it is necessary to manually clean the clogged hole position of the panel after the bonding is completed. , manual cleaning is easy to damage the honeycomb and affect the structural strength of the component
[0009] (1) Because the ribs are blocked or occupy a large number of spaces, the noise reduction effect of the parts is significantly reduced
[0010] (2) Due to the lack of noise reduction methods such as honeycomb, the noise reduction effect of this technology is poor
[0011] However, the above two molding techniques are only suitable for the molding of honeycomb sandwich structures with large perforation apertures in the panel. This type of product is only suitable for noise reduction of low-frequency and low-decibel (≤90dB) noise, and is suitable for high-frequency and high-decibel ( ≥90dB) noise reduction noise reduction has no obvious effect
[0012] In summary, the existing bonding technology of micro-perforated panel honeycomb sandwich structure obviously has inconvenience and defects in actual use, so it is necessary to improve it.

Method used

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  • Gluing method, structure and parts of micro-perforated panel and honeycomb sandwich structure
  • Gluing method, structure and parts of micro-perforated panel and honeycomb sandwich structure
  • Gluing method, structure and parts of micro-perforated panel and honeycomb sandwich structure

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Embodiment Construction

[0047] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0048] see figure 1 and figure 2 , in a first embodiment of the present invention, a method for bonding a micro-perforated panel honeycomb sandwich structure is provided, the method comprising the steps of:

[0049] In step S101, the pre-selected panel material is subjected to preset panel forming processing and panel perforation processing to form the upper panel 10 and the lower panel 20;

[0050] In step S102, an adhesive film is laid on the glued surface of the upper panel 10 and the lower panel 20 respectively, and a preset temperature and pressure are applied to the adhesive film from one ...

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Abstract

The invention belongs to the technical field of sound elimination and noise reduction, and provides a gluing method, the structure and parts of a micro-perforated panel and honeycomb sandwich structure. The method comprises the following steps that A, preselected panel materials are subjected to preset panel forming and panel perforating, so that an upper panel and a lower panel are manufactured; B, the gluing surfaces of the upper panel and the lower panel are covered with gluing films correspondingly, and the gluing films are heated and pressed from one sides according to the preset temperature and pressure and penetrate through the perforated positions of the upper panel and / or the lower panel; and C, the gluing surface of the upper panel is bonded to the top surface of a honeycomb structure, and the gluing surface of the lower panel is bonded to the bottom surface of the honeycomb structure, so that the micro-perforated panel and honeycomb sandwich structure is manufactured. Thus, the effect of reducing and eliminating high-frequency and high-decibel noise is improved for the micro-perforated panel and honeycomb sandwich structure.

Description

technical field [0001] The invention relates to the technical field of noise reduction and noise reduction, in particular to a bonding method of a micro-perforated panel honeycomb sandwich structure and its structure and parts. Background technique [0002] Microporous panel honeycomb sandwich structure bonding technology is mainly used in noise reduction and noise reduction structural products to control and reduce noise. The prior art of forming the honeycomb sandwich sound-absorbing and noise-reducing structure mainly contains the following two technical solutions: [0003] The first type: use perforated panels and room temperature liquid epoxy adhesive to bond aluminum honeycomb, glass cloth honeycomb and aramid paper honeycomb. After the gluing is completed, clean the clogged holes of the panel by manual or mechanical processing. Products formed by this method are often used in ships, etc. [0004] The second type: use veneer perforated panels, which are mechanically...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/52B29L31/60
CPCB29C65/52B29L2031/608
Inventor 叶国锐游海涛石冠鑫张孝通李望
Owner 深圳市同海高科技实验室有限公司
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