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Manufacturing method of printed circuit board

A printed circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuits, and the formation of electrical connection of printed components, can solve problems such as inability to be practical, insufficient electrical properties, noise generation, etc., to save raw materials and shorten the process. , the effect of improving productivity

Inactive Publication Date: 2019-08-13
INKTEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, due to the characteristics of circuit formation, there is a problem of noise generation when it is attached to the battery pack and the outer case by the above-mentioned printing method, and its electrical characteristics are insufficient, so it cannot be put into practical use.

Method used

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  • Manufacturing method of printed circuit board
  • Manufacturing method of printed circuit board
  • Manufacturing method of printed circuit board

Examples

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Embodiment Construction

[0072] The advantages and characteristics of the present invention, and the method for achieving them will be clarified with reference to Examples described in detail later. However, the present invention is not limited to the embodiments disclosed below, but can be embodied in various forms that are different from each other. This embodiment is only to make the disclosure of the present invention more complete, so that those of ordinary skill in the technical field of the present invention can clearly understand the invention The scope of the claims is provided, and the present invention will be defined by the scope of the claims.

[0073] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification will be used in the meaning that can be commonly understood by those of ordinary skill in the technical field of the present invention. Also, terms defined in commonly used dictionaries cannot be interpreted abnormally or excessively if...

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Abstract

The present invention relates to a printed circuit board and a method for manufacturing the same. By fabricating a flexible printed circuit board consisting of a copper foil and an insulating layer only, a thin film double-sided printed circuit board can be manufactured, and raw materials and the number of processes can be reduced at the same time.

Description

technical field [0001] The present invention relates to a method for manufacturing a printed circuit board, and in more detail relates to a thin-film flexible printed circuit board that can only be made of copper foil (copperfoil) and an insulating layer, while saving raw materials and shortening the process. method. Background technique [0002] In general, a printed circuit board (Printed Circuit Board) is a substrate-shaped electronic component mounted with various electronic components and electrically connected to each other. [0003] Printed circuit boards are roughly divided into rigid printed circuit boards (Rigid Printed Circuit Board) and flexible printed circuit boards (Flexible Circuit Board) according to the hardness and softness of the substrate. Recently, rigid and flexible composite printed circuit boards have also been born. [0004] In the initial stage of the application of printed circuit boards, products with a relatively simple structure with printed c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/40
CPCH05K3/06H05K3/403H05K2203/052
Inventor 郑光春韩英求金修汉尹光伯
Owner INKTEC CO LTD